2013
DOI: 10.1109/tcpmt.2012.2226458
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Oven Sintering Process Optimization for Inkjet-Printed Ag Nanoparticle Ink

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Cited by 64 publications
(36 citation statements)
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“…Temperatures of 200 °C or even more are often required in order to completely burn off all organic residues and thus allow small metal particles to coalesce and form a macroscopic network within which electrons can percolate over long distances. It is worth mentioning that the electrical resistivity of the sintered layer increases if sintering temperature and duration decrease; it is therefore possible to perform thermal sintering at lower temperatures if higher resistivity is not detrimental to the target application …”
Section: Functional Inks For Inkjet‐printingmentioning
confidence: 99%
“…Temperatures of 200 °C or even more are often required in order to completely burn off all organic residues and thus allow small metal particles to coalesce and form a macroscopic network within which electrons can percolate over long distances. It is worth mentioning that the electrical resistivity of the sintered layer increases if sintering temperature and duration decrease; it is therefore possible to perform thermal sintering at lower temperatures if higher resistivity is not detrimental to the target application …”
Section: Functional Inks For Inkjet‐printingmentioning
confidence: 99%
“…Its high thermal stability ensures that the layer withstands the high‐sintering temperatures commonly used for silver sintering. Higher sintering temperatures lead to faster accomplishment of the desired conductivity by a faster sintering process …”
Section: Inkjet‐printed Test Samplesmentioning
confidence: 99%
“…After filling the vias, the sample is placed in convection oven heated to 220 °C for 1 h as recommended by the ink manufacturer [13], and taking into account our previous study on oven sintering process optimization for inkjet-printed Ag nanoparticle ink [15]. In the sintering process, first the solvent ( figure 2(c)) and dispersant material around the nanoparticles evaporate and then, because of partial melting and welding of nanoparticles, a uniform conductive layer will be formed [15].…”
Section: Fabrication Processmentioning
confidence: 99%
“…In the sintering process, first the solvent ( figure 2(c)) and dispersant material around the nanoparticles evaporate and then, because of partial melting and welding of nanoparticles, a uniform conductive layer will be formed [15].…”
Section: Fabrication Processmentioning
confidence: 99%