2013
DOI: 10.1016/j.microrel.2013.07.126
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Overview of catastrophic failures of freewheeling diodes in power electronic circuits

Abstract: Emerging applications (e.g. electric vehicles, renewable energy systems, more electric aircrafts, etc.) have brought more stringent reliability constrains into power electronic products because of safety requirements and maintenance cost issues. To improve the reliability of power electronics, better understanding of failure modes and failure mechanisms of reliability-critical components in power electronic circuits are needed. Many efforts have been devoted to the reduction of IGBT failures, while the study o… Show more

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Cited by 33 publications
(15 citation statements)
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“…According to a study reported in [86], 34% of power electronic system failures are related to semiconductor devices. These results are consistent with those of another study reported in [87] can take place as a result of static high voltage breakdown, rise of leakage current, snappy recovery, reverse recovery dynamic avalanche, and high-power dissipation [92].…”
Section: A) Reliabilitysupporting
confidence: 93%
“…According to a study reported in [86], 34% of power electronic system failures are related to semiconductor devices. These results are consistent with those of another study reported in [87] can take place as a result of static high voltage breakdown, rise of leakage current, snappy recovery, reverse recovery dynamic avalanche, and high-power dissipation [92].…”
Section: A) Reliabilitysupporting
confidence: 93%
“…Tables 1-3 show the O, D and S classification respectively [43,44]. Table 4 is the FMEA table with the top functions, failure modes, failure cause, failure mechanism, and mechanism type, as well as risk priority number (RPN) as an initial estimation of risk of subcomponents of the power stage in a PEMFC system [45,46]. FMEA is an important step in the reliability assessment.…”
Section: Failure Mechanisms and Failure Modes Analysismentioning
confidence: 99%
“…The diode open-circuit fault may occur owing to various reasons, e.g. overcurrent, high temperature fatigue, and mismatch of coefficients of thermal expansion between silicon and aluminum [24][25][26] would result in bond wire lift-off failure and cause diode open-circuit fault, which is one of the important fault issues for MMCs [14] and may seriously affect the performance of the MMC. In this paper, the fault characteristics of the MMC under diode open-circuit fault are analyzed and an effective protection scheme is proposed.…”
Section: MMCmentioning
confidence: 99%