Oxidation and reduction processes in Ni/Cu/Cr/Si(100) thin films under low-energy ion irradiation

Kruhlov, І. O.; Vladymyrskyi, І. А.; Dubikovskyi, Oleksandr; Sidorenko, Sergiy S; Ebisu, Tomio; Kato, Kenichi; Sakata, Osami; Ishikawa, Tetsuya; Iguchi, Yusuke; Langer, G.A.; Erdélyi, Zoltán; Voloshko, S. М.

doi:10.1088/2053-1591/ab6382

Cited by 7 publications

(3 citation statements)

References 56 publications

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“…The development of reduction processes at the internal interfaces is associated with the long-range effects induced by low-energy ions, which has been discussed in detail elsewhere [15]. Optimal ion treatment mode (energy of 800 eV and fluence of 5.6⋅10 16 ion/cm 2 ) caused a simultaneous passivation of all film layers with decreased presence of oxygen and carbon impurities. Since reduction processes yield first of all at the Cr/Si interface, it brings light on the change in destruction behaviour in this area.…”

Section: Discussionmentioning

confidence: 99%

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Thermal and Ion Treatment Effect on Nanoscale Thin Films Scratch Resistance

Yanchuk¹,

Kruhlov²,

Закиев³

et al. 2022

Metallofiz. Noveishie Tekhnol.

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In this study, a microtribological characteristics of Ni(25 nm)/Cu(25 nm)/ Cr(25 nm) three-layer thin films fabricated using DC magnetron sputtering are explored using progressive scratch test. Four various types of thin films are examined and compared: as-deposited film, film after low-energy Ar + ion irradiation, film annealed at 450°С for 15 minutes in vacuum, and film after ion irradiation followed by vacuum annealing. Scratch tests are supplemented by structural (XRD) and chemical (AES) experimental studies. As figured out, the sample after ion irradiation followed by annealing demonstrated the best microtribological and wear resistance characteristics among all studied films. The highest scratch resistance, smooth scratch shape, the lowest value of peak tangential force as well as the absence of side cracks and film delamination are revealed for the sample after irradiation followed by annealing. The likely reasons of this behaviour are discussed.

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Section: Discussionmentioning

confidence: 99%

“…This can provide additional opportunities to improve the properties of the conductive layer after the deposition of the layered structures [16] and before the subsequent technological operations associated with thermal exposure.…”

Section: Introductionmentioning

confidence: 99%

Thermal and Ion Treatment Effect on Nanoscale Thin Films Scratch Resistance

Yanchuk¹,

Kruhlov²,

Закиев³

et al. 2022

Metallofiz. Noveishie Tekhnol.

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“…Another implication of this simulation is the prediction of the surface roughness. It is well accepted that the oxidation of the metallic surface strongly depends on its morphology [40]. In turn, GR shows great potential for the corrosion resistance of metals (Me) [41].…”

Section: Discussionmentioning

confidence: 99%

Effect of Graphene on Nickel Surface Relaxation: Molecular Dynamics Simulation

Konorev,

Yanchuk,

Kruhlov

et al. 2023

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The effect of graphene (GR) on Ni surface relaxation and reconstruction in three different substrate orientations, {111}, {001}, and {011}, at two different temperatures, 300 K and 400 K, was studied using molecular dynamics simulation. The change in the interplanar distances of the substrate and redistribution of Ni and C atoms in a direction perpendicular to the surface was compared with the equilibrium state of GR and bulk Ni, in the absence of the counterpart. The surface reconstruction for the GR/Ni system was analyzed based on the calculated radial pair distribution functions of Ni and C atoms. The surface roughness was visualized using 2D atomic distribution maps. The introduction of GR on the Ni surface in any crystallographic orientation decreases the maximum modification of interplanar spacing compared to the bulk by less than 1%. For the studied substrate orientations and temperatures, it was found that the most densely packed {111} orientation of the Ni base provides minimal changes in the structural parameters of both counterparts at 400 K. Additionally, the system formed by GR deposition on Ni {111} at 400 K is characterized by the least roughness.

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