2004
DOI: 10.1007/s11085-004-7810-z
|View full text |Cite
|
Sign up to set email alerts
|

Oxidation Kinetics of Epitaxial (100) Copper Films at 25°C and 50°C

Abstract: Very-thin-film kinetics data are presented for oxide growth on parent epitaxially formed (100) copper crystals at 25 and 50 • C with different oxygen pressures in the range 0.01 torr to 170 torr. The results are interpreted in terms of the model based on electric-field driven ionic diffusion associated with the electrostatic-potential difference created by an electron-tunnelcurrent-virtual equilibrium.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
2
0

Year Published

2005
2005
2018
2018

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 15 publications
(2 citation statements)
references
References 22 publications
0
2
0
Order By: Relevance
“…We analyzed the plot of L versus t in view of basic rate laws for the oxidation kinetics, i.e., logarithmic, inverse-logarithmic, linear, parabolic, cubic, and higher power rate laws. At lower temperatures and in thin oxide films, the inverse-logarithmic equation based on the theory by Cabrera and Mott has often been employed to explain the oxidation kinetics of Cu bulk surfaces. , But our data at both temperatures could not be fitted with this equation. The only equation that fit the data at 298 K was found to be direct-logarithmic, d L /d t = k exp(− L / L 0 ), where t is the exposure time at 9.3 × 10 4 Pa air pressure, k is the rate constant, and L 0 is constant.…”
mentioning
confidence: 86%
“…We analyzed the plot of L versus t in view of basic rate laws for the oxidation kinetics, i.e., logarithmic, inverse-logarithmic, linear, parabolic, cubic, and higher power rate laws. At lower temperatures and in thin oxide films, the inverse-logarithmic equation based on the theory by Cabrera and Mott has often been employed to explain the oxidation kinetics of Cu bulk surfaces. , But our data at both temperatures could not be fitted with this equation. The only equation that fit the data at 298 K was found to be direct-logarithmic, d L /d t = k exp(− L / L 0 ), where t is the exposure time at 9.3 × 10 4 Pa air pressure, k is the rate constant, and L 0 is constant.…”
mentioning
confidence: 86%
“…It is well known that the oxidation rate of bare Cu depends on the crystal orientation of the exposed surface. The oxidation kinetics of different Cu surfaces has been subject of many studies over the last decades [18][19][20][21][22][23]; however, the oxidation process itself is influenced by a number of factors, such as the morphology and surface defects of the sample [22,24,25], its thermal history [10] or the oxidation temperature [18,25], which has led to apparent contradictory results. It is thus expected that both, the oxidation process of graphene covered Cu, and the interaction between graphene and the intercalated oxide layer, would depend on the exposed Cu surface.…”
Section: Introductionmentioning
confidence: 99%