Oxidation kinetics of TiN thin films

Abstract

We have investigated the oxidation kinetics of TiN thin films in dry O2 in view of a possible application of TiN as material for gate electrodes and interconnections in large-scale integrated circuits. We found that in the temperature range of 500 to 650 °C the oxidation is thermally activated with an activation energy of 2.05±0.05 eV. Thereby the diffusion of oxygen through the oxide is the rate-limiting process. Analysis with x rays indicates that dry oxidation transforms TiN to the rutile form of TiO2. Films of TiO2 formed in such a manner are found to be semi-insulating with resistivities in the order of 106 Ω cm and at higher applied electric fields the injection of space-charge–limited currents is observed.

Machining Performance of Sputter-Deposited (Al0.34Cr0.22Nb0.11Si0.11Ti0.22)50N50 High-Entropy Nitride Coatings

“…Note that annealing this HEN at 900 °C for 50 h only leads to an oxide layer 330 nm in thickness [29]. In contrast, TiN severely oxidizes at above 550 °C, while TiAlN starts rapid oxidation at above 800 °C [7,15]. The two advantages together lead to better cutting performances, particularly under harsh cutting conditions.…”

“…Higher cutting speed, better machining quality, and longer tool life are thus accomplished by the usage of TiAlN coatings [13,16]. However, severe oxidation of TiAlN still takes place when temperature is higher than 800 °C [7,17]. Extended systems based on these coatings are thus developed and studied successively to meet the demands for higher temperature applications.…”

“…TiN is the most studied and used coating system for its high hardness, low coefficient of friction, and good adhesion to the substrates. However, its rapid oxidation starting at 550 °C limits the application in high speed machining [7,8]. TiCN coatings are known for their self-lubricating property and the particular low coefficient of friction [9][10][11][12].…”

Thermal Stability of Nanostructured Coatings

“…In order to extend the high temperature applications of TiN coatings, ternary Ti-Me-N coating systems (where Me can be B, Al, Si, Cr, and others) have been actively explored and studied [35][36][37]. Among these, Ti-Al-N coating layer showed, in several studies, improved oxidation resistance compared to that of TiN coating layers due to the formation of a stable Al 2 O 3 surface film by migration of aluminium atoms of the coating itself to the surface region [37,38].…”

Nanolink-based thermal devices : integration of ALD tin thin films

“…However, the properties of TiN are strongly influenced by the film stoichiometry, crystallinity, morphology and hence the deposition method [83,93]. Sputtered TiN layers with 1:1 stoichiometry are known to oxidize significantly in dry ambient (O 2 ) above 500 ºC [94,95], non-stoichiometric TiN layers (Ti 1 N 1-x ) even at room temperature [96].…”