A low-temperature solid-state bonding technology using silver-coated Cu microcones and Sn-3.0Ag-0.5Cu (wt.%) solder for three-dimensional (3D) packaging is presented. Electroless silver coating on the surfaces of copper microcones effectively reduces oxide layer growth and significantly enhances the solder joint shear strength from an average of 33.5 MPa to 43.4 MPa. Lowtemperature thermocompression bonding at 463 K in ambient air was achieved using silver-coated Cu microcones, with no voids found along the bonded interface. Microscopic observation revealed that the microcones were completely inserted into the soft solder. Probable mechanisms for this bonding process are proposed and discussed.