Oxidation of Solder Coatings

The oxides formed on the SnAg coated LHC superconducting cables during a 200 °C heat treatment in air are described and the oxide composition is compared with the interstrand contact resistance (R c). The analysis of more than 250 interstrand contact areas shows that the higher the average Cu content with respect to the Sn content in the oxide, the higher is R c. During the 200 °C heat treatment, Sn in the coating is transformed into a Cu 3 Sn layer, on which an oxide grows that consists essentially of a thin outermost layer of CuO on top of Cu 2 O, similar to the oxide structure formed on bare Cu. The underlying Cu 3 Sn layer acts as an O diffusion barrier that prevents O diffusion into the Cu bulk during the subsequent cable heat treatment under high pressure. On contact zones where the Cu 3 Sn layer is not formed during the 200 °C heat treatment mainly Sn oxide grows and R c is comparatively low.

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Oxidation of Solder Coatings

Cited by 4 publications

References 58 publications

XPS Study of the Oxidation Behavior of the Cu3Sn Intermetallic Compound at Low Temperatures

XPS Study of the Oxidation Behavior of the Cu3Sn Intermetallic Compound at Low Temperatures

The role of Cu-Sn intermetallics in wettability degradation

Oxidation and contact resistance of Sn–Ag coated superconducting strands for the Large Hadron Collider (LHC)

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