“…Electroless plating bath typically contains metal-salts, reducing agent (i.e., formaldehyde), alkaline hydroxide (i.e sodium hydroxide), chelating agents (i.e., EDTA, Rochelle salts), stabilizer and brightener. This process is conducted at bath temperature in the range 45–65 °C [ 296 , 297 , 298 , 299 ]. A versatile explanation of mechanism of electroless plating process based on electrochemical reactions is presented [ 300 , 301 , 302 ].…”