The
growth behaviors and electrical performances of semiconducting
ZnO, SnO2, and (Zn,Sn)O
x
thin
films, grown by atomic layer deposition (ALD) using O3 as
the oxygen source, were studied. A significant incubation stage was
observed for ZnO ALD on the Si substrate, but not for the SnO2 thin-film substrate. The incubation cycles, along with the
grain size, were increased with O3 feeding time, implying
that the reactivity of the Zn-precursor varied with the degree of
oxidation of the Si surface. The adsorption of the Zn-precursor in
the early stage of (Zn,Sn)O
x
ALD was facilitated
with an increasing concentration ratio of Sn to Zn. The electrical
performance of the (Zn,Sn)O
x
film as a
channel layer was estimated by fabricating bottom-gate thin-film transistors
(TFTs). The TFT transfer curves showed an evident negative shift of
threshold voltage as the Sn-concentration increased in (Zn,Sn)O
x
films. The best electrical performance of
the oxide TFTs was observed when the Sn-concentration was 40 at %
with a threshold voltage of −0.12 V, subthreshold swing of
0.33 V decade–1, field-effect mobility of 13.6 cm2 V–1 s–1, and saturation
mobility of 6.20 cm2 V–1 s–1. The amorphous structure of the films could be retained up to 600
°C of post-annealing. These performances are promising for the
next-generation TFT for a vertical NAND flash or cell-stacked dynamic
random access memory.