2004
DOI: 10.1889/1.1831072
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P‐111: A Thin Film Encapsulation Stack for PLED and OLED Displays

Abstract: For a thin film (< 1 μm) encapsulation stack consisting of only 3 plasma deposited silicon nitride layers separated by a thin (< 100 nm) organic layer, a water permeation rate of below 10−5 g/m2 per day at 50 °C and 50% rH has been measured using the Ca test. PLED lifetimes of over 500 hours at 60 °C and 90% rH have been reached locally. While the Ca test indicates that pinhole free encapsulation is possible, edge and particle related defects still forecast a challenge for device encapsulation.

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Cited by 23 publications
(6 citation statements)
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“…In addition to their use as gate and interlayer dielectrics, silicon oxides and nitrides can be considered as transient passivation/encapsulation layers. These materials are well known to be good barrier materials for permeation of water vapor in conventional electronics . Previous research on encapsulation with PECVD oxide and nitride in organic light‐emitting diode (OLED) devices indicates that defects, such as pinholes, are a primary cause of leakage of vapors or fluids.…”
Section: Encapsulation Strategy With Inorganic Layersmentioning
confidence: 99%
“…In addition to their use as gate and interlayer dielectrics, silicon oxides and nitrides can be considered as transient passivation/encapsulation layers. These materials are well known to be good barrier materials for permeation of water vapor in conventional electronics . Previous research on encapsulation with PECVD oxide and nitride in organic light‐emitting diode (OLED) devices indicates that defects, such as pinholes, are a primary cause of leakage of vapors or fluids.…”
Section: Encapsulation Strategy With Inorganic Layersmentioning
confidence: 99%
“…The pretty straightforward structure of the LC device had better advantages than the mainly studied devices nowadays in the deformable display area such as OLED, PLED, and PDLC . Firstly, the LC device only containing one display layer and two electrode layers was much more simply than OLED and PLED devices which were composed of three different and complex layers .…”
Section: Resultsmentioning
confidence: 99%
“…Firstly, the LC device only containing one display layer and two electrode layers was much more simply than OLED and PLED devices which were composed of three different and complex layers . Secondly, LC device could be prepared conventionally in air with water and oxygen, but it did not work for OLED and PLED because of their great sensitivity for water and oxygen, so it put forward higher demand for package technology and encapsulation materials for OLED and PLED, especially the flexible devices bending for many times. Meanwhile PDLC also had the weaknesses of complicated preparation technology, poor controllability, using organic solvents, narrow selection for solvents and polymers, and lots of unstable affecting factors in the process of polymerization .…”
Section: Resultsmentioning
confidence: 99%
“…And we propose a mechanism to explain the advantage of multilayer SiNx process. Low RF power for first lamination could reduce the plasme damage to OLED devices, and the rest of lamintion was precisely tuned by mechanical and optical models, besides, multilayer process could reduce the internal deffects [6,7,8] . All these results in better barrier performance.…”
Section: Tfe Performance On Oled Devices With New Multilayer Sinx Strmentioning
confidence: 99%