Package-Level Integrated LTCC Antenna for RF Package Application

Wi, Sang-Hyuk; Kim, Jin-Seok; Kang, Nam-Kee; Kim, Jun-Chul; Yang, Hoon‐Gee; Kim, Youngsoo; Yook, Jong-Gwan

doi:10.1109/tadvp.2006.890216

Cited by 41 publications

(17 citation statements)

References 18 publications

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“…LTCC multilayer technology can be used to build up antenna arrays because it provides the necessary degree of vertical integration for the high-density microwave circuit and a packaging solution such as SIP (System in Package) (Wolff, 2007, Baras and Jacob, 2008, Wi et al, 2007. To optimise the material properties by reducing the relative permittivity of LTCC, a material modulation procedure based on punching air holes into the substrate is performed.…”

Section: Ltcc Micromachiningmentioning

confidence: 99%

Micromachined High Gain Wideband Antennas for Wireless Communications

Pavuluri¹,

Wang²,

Sangster³

2010

Mobile and Wireless Communications Network Layer and Circuit Level Design

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Section: Ltcc Micromachiningmentioning

confidence: 99%

Micromachined High Gain Wideband Antennas for Wireless Communications

Pavuluri¹,

Wang²,

Sangster³

2010

Mobile and Wireless Communications Network Layer and Circuit Level Design

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“…In numerous publications, to protect the chip from the near-field coupling of the radiating element, the authors use a shielding between the antenna and the chip packaging. This shield can play also the role of ground plane for the radiating element [3], [4]. A limited radiation towards the chip can also be obtained by controlling the antenna electric field [5].…”

Section: Introductionmentioning

confidence: 99%

Comparison study between single and differential miniature UWB antenna

Clauzier

Bories

Delaveaud

2014

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)

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A comparison study between single and differential -UWB-antenna approach for body area network (BAN) applications is proposed in this paper. For compactness reasons, the antennas are studied in order to be integrated on a chip packaging (QFN64 package). In addition, a special attention has been given to design antennas with main polarization normal to the human head. Two antennas structure has been developed taking into account these strong requirements. These antennas provide broadband characteristics and omnidirectional radiation patterns over the whole 7 -9 GHz frequency band. Antennas performances obtained by simulation and measurement are compared in order to open a discussion on the advantages and drawbacks of each structure.

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“…In order to realize the high-level integration, the antenna-in-package (AiP) was proposed. In [5] and [6], package-level integrated antennas with the "package side wall" were proposed, and the effect of package structure on antenna was also researched. In [7], the theory of differential antenna is introduced.…”

Section: Introductionmentioning

confidence: 99%

Differential Dual-Band Antenna-in-Package With T-Shaped Slots

Zhang

Yan

et al. 2012

Antennas Wirel. Propag. Lett.

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A differential dual-band antenna-in-package (AiP) with multilayer structure is proposed. Compared to the normal antenna, the introduced package structure changes the impedance of the antenna, such that the new resonant frequency is excited. Then, a dual-band antenna is realized. Also, in order to improve the radiation pattern in higher band, two symmetrical T-shaped slots are etched on the patch. The T-slots can help to widen the bandwidths. The realized AiP can work at 2.49 and 5.8 GHz. The 10-dB relative bandwidth is 1.61% (2.47 2.51 GHz) and 5.51% (5.67 5.99 GHz), respectively.

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Package-Level Integrated LTCC Antenna for RF Package Application

Cited by 41 publications

References 18 publications

Micromachined High Gain Wideband Antennas for Wireless Communications

Micromachined High Gain Wideband Antennas for Wireless Communications

Comparison study between single and differential miniature UWB antenna

Differential Dual-Band Antenna-in-Package With T-Shaped Slots

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