Package-on-Package (PoP) warpage characteristic and requirement

Abstract

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging. The warpage characterization also extended to evaluate the effect of bake and Moisture Exposure Time (MET) on package dynamic warpage. These will provide a better holistic view of cause and effect in PoP package stacking. Keywords-dynamic warpage; Package-on Package (PoP).