Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging. The warpage characterization also extended to evaluate the effect of bake and Moisture Exposure Time (MET) on package dynamic warpage. These will provide a better holistic view of cause and effect in PoP package stacking. Keywords-dynamic warpage; Package-on Package (PoP).

Innovation in electronic packag integrated significant computing function wit more efficient foot print of electronic dev challenges of electronic package technology, th warpage behavior received constant focus component board assembly yield. In this pa warpage trends for Package on Package and i Ball Grid Array and Flipped Chip Ball Grid A presented to provide an overview of current package warpage based on the samples do enables the electronic industry to understand f specification available and to understand method used to characterize the recent p warpage. The effect of bake and manufacturin package dynamic warpage and the challeng shape will be discussed and should be con package warpage characterization.