Recent trend of package warpage characteristic

Abstract

Innovation in electronic packag integrated significant computing function wit more efficient foot print of electronic dev challenges of electronic package technology, th warpage behavior received constant focus component board assembly yield. In this pa warpage trends for Package on Package and i Ball Grid Array and Flipped Chip Ball Grid A presented to provide an overview of current package warpage based on the samples do enables the electronic industry to understand f specification available and to understand method used to characterize the recent p warpage. The effect of bake and manufacturin package dynamic warpage and the challeng shape will be discussed and should be con package warpage characterization.