Packaging and testing of multi-wavelength DFB laser array using REC technology

Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guoxing; Luan, Jia

doi:10.1016/j.optcom.2013.09.008

Cited by 3 publications

(3 citation statements)

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“…In this article, the experiment results show that the threshold currents from 6 mA to 9 mA are first achieved at 1550 nm at room temperature. This is highly improved comparing with the array based on RWGs whose thresholds are typically of 20 mA . At the same time, good lasing wavelength precision is also obtained.…”

Section: Introductionmentioning

confidence: 88%

“…The reconstruction equivalent chirp (REC) technique was proposed recently and has been successfully applied to fabricate the laser arrays . According to the REC technique, the various complex grating structures, such as phase shifts, chirp, and apodization, can be equivalently realized by predesigning the sampled gratings with uniform basic grating (seed grating) .…”

Section: Introductionmentioning

confidence: 99%

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Integrated buried heterostructure DFB laser array for WDM systems based on reconstruction equivalent chirp technique

Song

Wang

et al. 2015

Microw. Opt. Technol. Lett.

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used for an overall look at the very first design steps, noise figure is tried to be matched in first stage without much compromise in gain, return loss, and bandwidth. Considering the selected bias points and these constraints, minimum noise figure is found near 70 GHz. However, in full layout simulations, this frequency shifted to 60 GHz being 4 dB and, at 77 GHz, noise figure is simulated as 4.45 dB. From the simulations, it is seen that the measured results almost overlaps the simulation results in gain and return loss performances.In Figure 7, input and output power handling performances extracted from the simulations of each are presented. From the results, it is seen that LNA1, LNA2, and LNA3 have output 1 dB compression points of 26, 210, and 24 dBm. Furthermore, LNA3 has a 5.5 dBm of OIP3 (output third-order intercept point) from two-tone intermodulation simulations.In Table 1, some of the state-of-the-art LNAs (mostly SiGe technology for a proper comparison including some other technologies) operating in W-band are shown. According to the results of proposed LNA3, highest bandwidth and gain with low noise figure are extracted while input and output return losses are better than 10 dB for the whole frequency band which implies that LNA3 could be used as a complete amplifier, not requiring any off-chip matching networks. CONCLUSIONThis article presents the results of fabricated W-band LNA chips that were built using the SiGe BiCMOS 0.13 mm SG13G2 technology of IHP Microelectronics. The chips are designed based on common-emitter topology with cascode, single-ended, and multi-stage configurations. Among these chips, the three-stage single-ended HBT-based amplifier offers an ultra-wideband operation to be utilized in W-band automotive and imaging applications. To the best of the authors' knowledge, this design achieves one of the best overall performances compared to other W-band LNAs (see Table 1).ACKNOWLEDGMENT ABSTRACT: A four-antenna multiple-input multiple-output (MIMO) system with the most compact radiators for small mobile terminals is presented in this letter. The MIMO antenna has four identical elements which are positioned in each corner of the PCB board. Each antenna element consists of an L-shaped radiator and two interdigital shorting stubs, producing the 2.4/5.2/5.8 GHz wireless local area network bands with a small size of only 6.5 3 9 mm 2 . Two different isolation structures are introduced simultaneously to mitigate mutual coupling between various elements. Consequently, mutual coupling less than 215 dB at both Figure 8 Characteristics of spectrum and SMSR values by changing the temperature. [Color figure can be viewed in the online issue, which is available at wileyonlinelibrary.com]

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Section: Introductionmentioning

confidence: 88%

Section: Introductionmentioning

confidence: 99%

Integrated buried heterostructure DFB laser array for WDM systems based on reconstruction equivalent chirp technique

Song

Wang

et al. 2015

Microw. Opt. Technol. Lett.

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“…For an 8-laser-chip array, an InGaAsAl multiple quantum well (MQW) is used as the active region, and the chips are fabricated by conventional two-stage lower-pressure metal-organic vapor phase epitaxy (MOVPE). The wavelength of the 1.5 μm DFB laser is well controlled with a fine grating structure, such as phase shifts based on the reconstruction-equivalent-chirp (REC) technique [15,16] . The DML array, double lens, and isolator array share a common thermoelectric cooler (TEC) for thermal stabilization.…”

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confidence: 99%

1.5 μm, 8?×?12.5 Gb/s of hybrid-integrated TOSA with isolators and ROSA for 100 GbE application

et al. 2016

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Compact transmitter and receiver optical sub-assemblies (TOSA and ROSA) are fabricated in our laboratory and have an aggregated capacity of 100 Gb/s. Specially, directly modulated laser (DML) drivers with two layers of electrical circuit boards are designed to inject RF signals and bias currents separately. For all the lanes, the 3 dB bandwidth of the cascade of the TOSA and ROSA exceeds 9 GHz, which allows the 12.5 Gb/s operation. With the 12.5 Gb/s × 8-lane operation, clear eye diagrams for back-to-back and 30-km amplified transmission with a dispersion compensation fiber are achieved. Low cost and simple processing technology make it possible to realize commercial production.

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