Packaging of electronic devices for long-term implantation

Kirsten, Sabine; Uhlemann, J.; Braunschweig, Markus; Wolter, K.-J.

doi:10.1109/isse.2012.6273121

Cited by 6 publications

(6 citation statements)

References 12 publications

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“…Studies examining these implants have demonstrated improvement in the vocal function of patients . Surgeries to adjust human aesthetics have also widely used silicon products, which were found to be safe with low infection rates. − Silicone was studied to be the most reliable for long-term encapsulation in the body compared to epoxy resin and polyurethane coatings because of their lower surface energy and smoother topography . These features also prevent cells and molecules from being absorbed by the polymer itself.…”

Section: Methodsmentioning

confidence: 99%

“…91−93 Silicone was studied to be the most reliable for long-term encapsulation in the body compared to epoxy resin and polyurethane coatings because of their lower surface energy and smoother topography. 94 These features also prevent cells and molecules from being absorbed by the polymer itself. There were also fewer defects observed on the silicon surface, indicating better protective functions.…”

Section: Polyethylene (Pe)mentioning

confidence: 99%

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Polymeric Biomaterials for Medical Implants and Devices

Teo

Mishra

Park

et al. 2016

ACS Biomater. Sci. Eng.

616

344

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In this review article, we focus on the various types of materials used in biomedical implantable devices, including the polymeric materials used as substrates and for the packaging of such devices. Polymeric materials are used because of the ease of fabrication, flexibility, and their biocompatible nature as well as their wide range of mechanical, electrical, chemical, and thermal behaviors when combined with different materials as composites. Biocompatible and biostable polymers are extensively used to package implanted devices, with the main criteria that include gas permeability and water permeability of the packaging polymer to protect the electronic circuit of the device from moisture and ions inside the human body. Polymeric materials must also have considerable tensile strength and should be able to contain the device over the envisioned lifetime of the implant. For substrates, structural properties and, at times, electrical properties would be of greater concern. Section 1 gives an introduction of some medical devices and implants along with the material requirements and properties needed. Different synthetic polymeric materials such as polyvinylidene fluoride, polyethylene, polypropylene, polydimethylsiloxane, parylene, polyamide, polytetrafluoroethylene, poly(methyl methacrylate), polyimide, and polyurethane have been examined, and liquid crystalline polymers and nanocomposites have been evaluated as biomaterials that are suitable for biomedical packaging (section 2). A summary and glimpse of the future trend in this area has also been given (section 3). Materials and information used in this manuscript are adapted from papers published between 2010 and 2015 representing the most updated information available on each material.

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Section: Methodsmentioning

confidence: 99%

Section: Polyethylene (Pe)mentioning

confidence: 99%

Polymeric Biomaterials for Medical Implants and Devices

Teo

Mishra

Park

et al. 2016

ACS Biomater. Sci. Eng.

616

344

View full text Add to dashboard Cite

show abstract

“…27 PDMS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 6 can be considered as a variety of silicone: inert, synthetic compounds whose basic structure is the inorganic compound of Si atoms with oxygen atoms (siloxane) and methyl groups occupying the remaining free valences. Moreover, it is inexpensive, transparent, and stretchable, and it can be conformably coated with a controlled thickness in addition to its capacity to form mold structures with high resolutions.…”

Section: Resultsmentioning

confidence: 99%

Nonplanar Nanoscale Fin Field Effect Transistors on Textile, Paper, Wood, Stone, and Vinyl via Soft Material-Enabled Double-Transfer Printing

et al. 2015

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The ability to incorporate rigid but high-performance nano-scale non-planar complementary metal-oxide semiconductor (CMOS) electronics with curvilinear, irregular, or asymmetric shapes and surfaces is an arduous but timely challenge in enabling the production of wearable electronics with an in-situ information-processing ability in the digital world. Therefore, we are demonstrating a soft-material enabled double-transfer-based process to integrate flexible, silicon-based, nano-scale, non-planar, fin-shaped field effect transistors (FinFETs) and planar metal-oxide-semiconductor field effect transistors (MOSFETs) on various asymmetric surfaces to study their compatibility and enhanced applicability in various emerging fields. FinFET devices feature sub-20 nm dimensions and state-of-the-art, high-κ/metal gate stacks, showing no performance alteration after the transfer process. A further analysis of the transferred MOSFET devices, featuring 1 µm gate length, exhibits an I ON value of nearly 70 µA/µm (V DS = 2 V, V GS = 2 V) and a low sub-threshold swing of around 90 mV/dec, proving that a soft interfacial material can act both as a strong adhesion/interposing layer between devices and final substrate as well as a means to reduce strain, which ultimately helps maintain the device's performance with insignificant deterioration even at a high bending state. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 5 Results and Discussions:The hetero-integration process is shown in Figure 1. It begins with the release of a thin layer of silicon of about 30 to 35 µm in thickness from a p-type (100) silicon wafer (figure 1a). The procedure of extracting such a fabric consists of deep trench formation followed by isotropic etching-based release, which has been demonstrated with various devices and thicknesses (5-50 µm) by controlling various design parameters, such as the trenches' depth, as explained in detail in our previous works. 25,26 The transfer process is then carried out by placing the released silicon fabric upside-down on a piece of polyimide film (Kapton) or copper foil, which is coated with unbaked photoresist ( Figure 1b). The photoresist layer is meant to protect the topside of the fabric, where electronic devices "sit", and we have found that a thick layer is the most effective (above 2 µm).Once the photoresist is baked, a thin layer of elastomer polydimethylsiloxane (PDMS) is spin coated on top to provide final adhesion and isolation from applied strains ( Figure 1c). The whole stack is then placed on top of the substrate of interest, and the PDMS layer is left for curing (Figure 1d). Finally, the pho...

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“…Conventional electronics can be used within IMDs but will require encapsulation within a polymer or in a hermetically sealed chamber. Low consistency silicone has been shown to have favourable water absorption, water solubility and surface characteristics for long term implantation when compared to epoxy resin or polyurethane [56]. Chambers or recesses can be manufactured within the bulk material of the implant be it metal, polymer, glass or ceramic and welded or bonded to create a hermetic seal [53].…”

Section: Biocompatibility and Integration Within The Implantmentioning

confidence: 99%