Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Mao, Chi; Chen, Rongsheng

doi:10.1016/j.microrel.2007.01.087

Cited by 9 publications

(8 citation statements)

References 8 publications

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“…A SEM observation exhibits the necking area of the wire under tensile load (see Figure 10). With an initial section area of 845 μm² and a final [7] section of 51 μm², we can derive a necking of 94% when fracture happens, which shows a high ductility of the material, consistent with the literature [19]. More, the maximum force applied before the break has been derived to a value of 186 mN.…”

Section: Resultssupporting

confidence: 84%

“…FEM simulations have been popularly used to analyze reliability effects of various design parameters and to validate best suited design scenarios for new products [4][5][6][7]. A package-dimensioned model and a wired-interconnect-centered model previously developed will be used in this paper to assess stress distribution with a limited computation time and an acceptable error range [8,9].…”

Section: Introductionmentioning

confidence: 99%

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RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Cauchois

Yin

Gouantes

et al. 2013

Microelectronics Reliability

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Abstract:RFID solutions will improve the traceability of biological samples stored at low temperature (77K) in biobanks. To achieve this goal, the reliability of RFID tags is essential. In this paper, we focus on the reliability aspect of RFID tags in harsh environment and more specifically to assembly design optimization through numerical simulations and accelerated life tests. A packagedimensioned model and a wire-interconnect centered model have been used to assess stress distribution in the package and wire bonds. We also develop a specific versatile test bench to apply thermal cycling while monitoring the functionality of the tags. We investigate 3 different tag configurations and demonstrate that the main failure mode is related to wire breaks. The occurrence of this failure depends mainly on the nature and thickness of the encapsulant resin which induce compressive and tensile stresses during thermal cycling. FEM results are in good agreement with observed failures.

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Section: Resultssupporting

confidence: 84%

Section: Introductionmentioning

confidence: 99%

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Cauchois

Yin

Gouantes

et al. 2013

Microelectronics Reliability

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“…The Anand viscoplasticity constitutive model is adopted for solder joint analysis. Furthermore, the package life is estimated on the basis of the Darveaux energy‐based model, which confirms that the fatigue reliability of solder balls is dependent on the uniformity of the accumulated SED and can be improved through design optimization. Using the integrated objective value D as fatigue reliability indicator, the genetic algorithm (GA) combined with analysis of variance (ANOVA) is applied to investigate factor cross‐coupling effects for both response surface methods (RSM).…”

Section: Introductionmentioning

confidence: 59%

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng

Chen

Mao

2013

Quality & Reliability Eng

Self Cite

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A global/local method with the modified sub-modeling approach of the two-parametric optimal equivalent volume solder balls is introduced to predict the deformation and reliability of the package. The equivalent solder balls as exhibit in this method can obviously reduce the required elements/nodes quantities to enhance computing efficiency. A package model of wire-bonded stacked chip ball grid array under cyclic thermal loading is used as a test vehicle to verify the influences of design factors by fatigue life indicator. Comparing the proposed method with the global fine mesh model, it is found that the difference in the accumulated strain energy density is merely 5.77%, but the optimal equivalent model has highly saved 90% finite element analysis required elements, which means the adopted method can effectively replace the global fine mesh model because both results are in accordance with each other. Using design of experiments to efficiently verify each factor influence with their crosscoupling effects, this paper adopts two kinds of response surface methods that confirm the fatigue life of the proposed approach can be improved by as much as 123.7% for the dual response surface method and 126.3% for the mixed response surface method when comparing with the baseline model. In addition, the optimization of generic algorithm for both response surface methods is demonstrated in this study. From the reviews of factor coupling effects, it is concluded that the response surface method is eligible to achieve the optimum design for package reliability improving.

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“…hanical behaviour of FR4 PCB board is assumed as orthotropic, linear elastic and temperature depen In order to obtain accurate simulation, temperature dependent material properties obtained from the stress strain Hence, a statistical method incorporating linear regression was employed to quantify the temperature FR4 PCB board. The constitutive relation, as given by (Mao et al, 2008):…”

Section: Materials Properties and Thermal Loadingmentioning

confidence: 99%

“…The molding compound material is assumed to be isotropic and linear elastic. linear elastic and temperature dependent (Otiaba et al, 2013) given by: er materials SnAg3.5, Sn67Pb37, SAC305 (Sn96.5Ag3Cu0.5) are assumed with elasto ays a very important role in deformation behavior of solder joint at homologous temperature of SnAg3.5 (Lu et al, 1997) and SnPb (Mao et al, 2008)…”

Section: Materials Properties and Thermal Loadingmentioning

confidence: 99%

Méthodologie probabiliste basée sur la simulation pour l’évaluation de la fiabilité des systèmes mécatroniques embarqués

Aoues¹,

Makhloufi²,

Pougnet³

et al. 2015

Congrès Lambda Mu 19 De Maîtrise Des Risques Et Sûreté De Fonctionnement

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La durée de vie des systèmes mécatroniques embarqués est souvent liée à la défaillance des joints de brasure des composants électroniques par fatigue thermique. Les directives européennes actuelles interdisent l'utilisation des brasures à base de plomb et en recommandant leurs remplacements par des alliages sans plomb. Toutefois, la caractérisation de ces nouveaux alliages n'est pas encore complètement effectuée. De plus, la durée de vie de ces brasures est souvent étudiée par des modèles déterministes. Ces modèles combinent la caractérisation expérimentale et une modélisation physique du phénomène de fatigue nécessitant l'utilisation des méthodes de simulation telle que la méthode des éléments finis. Cependant, ces modèles ne considèrent pas les incertitudes des paramètres du modèle et des dimensions géométriques et la fluctuation des chargements thermiques et des conditions d'opération en service. En effet, l'évaluation de la fiabilité des composants électroniques des systèmes embarqués doit s'appuyer sur des approches probabilistes. Dans cette communication une approche probabiliste est développée pour l'estimation de la durée de vie probabiliste des joints de brasure d'un système mécatronique embarqué. Cette méthodologie combine la modélisation probabiliste des paramètres d'entrée, la modélisation numérique non linéaire de la fatigue thermique du joint de brasure, l'approximation du modèle numérique par un metamodèle de krigeage et l'utilisation des simulations de Monte Carlo pour l'estimation de la distribution probabiliste de la durée de vie en fatigue.

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Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Cited by 9 publications

References 8 publications

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Méthodologie probabiliste basée sur la simulation pour l’évaluation de la fiabilité des systèmes mécatroniques embarqués

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