Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Iwasaki, N.; Yanagibashi, M.; Tsunetsugu, H.; Kato, Kazutoshi; Ishitsuka, F.; Hosoya, Masahiro; Kikuchi, Hiroyuki

doi:10.1109/6040.982825

Cited by 5 publications

(1 citation statement)

References 15 publications

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“…Research on WGPD and WGPD submodules has been conducted by several authors. Kato [8]. However, there has not been any report on measurement-based circuit models for WGPD submodules on the basis of an equivalent circuit model of WGPDs.…”

Section: Introductionmentioning

confidence: 92%

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Lee

Jeon

Yoon

et al. 2006

IEEE Trans. Adv. Packag.

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In this paper, the circuit models of a waveguide photodiode (WGPD) and its submodule were investigated, and the O/E characteristics of a WGPD submodule are examined. Test structures of the WGPD and WGPD submodule were fabricated and microwave return loss (S11) was measured and compared with simulated data to validate the circuit models. With the established submodule model, optical to electrical (O/E) characteristics were measured and compared with the modeled data to analyze the effects of model parameters on the submodule performance. Based on the results, it can be concluded that the suggested submodule model can explain the characteristics of the submodule performance. In addition, parasitic components that originated from the ribbon bonding block can crucially impact on the performance of WGPD submodule.Index Terms-Circuit model, optical receiver module, optical to electrical (O/E) response, waveguide photodiodes (WGPDs).

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Section: Introductionmentioning

confidence: 92%

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Lee

Jeon

Yoon

et al. 2006

IEEE Trans. Adv. Packag.

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Extremely compact (0.3 cm ³ ) 40 Gbit/s optical receiver module with ease-of-use receptacle interface and feedthrough launcher

et al. 2004

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High speed digital signal analysis of ultra-broadband micromachined flip-chip interconnect designs

Cho

Drayton

2008

2008 58th Electronic Components and Technology Conference

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Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Cited by 5 publications

References 15 publications

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Extremely compact (0.3 cm ³ ) 40 Gbit/s optical receiver module with ease-of-use receptacle interface and feedthrough launcher

High speed digital signal analysis of ultra-broadband micromachined flip-chip interconnect designs

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Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Cited by 5 publications

References 15 publications

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Modeling O/E Characteristics of 40-Gb/s InGaAs Side-Illuminated Waveguide Photodiode Submodule for Optical Receivers

Extremely compact (0.3 cm 3 ) 40 Gbit/s optical receiver module with ease-of-use receptacle interface and feedthrough launcher

High speed digital signal analysis of ultra-broadband micromachined flip-chip interconnect designs

Contact Info

Product

Resources

About

Extremely compact (0.3 cm ³ ) 40 Gbit/s optical receiver module with ease-of-use receptacle interface and feedthrough launcher