Parallel optical interconnects

Buckman, L.A.; Giboney, K.; Straznicky, Joseph; Simon, Jean Claude; Schmit, A.J.; Zhang, X.J.; Corzine, S.; Dolfi, David W.; Madhavan, B.; Kiamilev, Fouad

doi:10.1109/cleo.2000.907355

Cited by 12 publications

(2 citation statements)

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“…For example, a ten-channel fiber optic transceiver module known as the Parallel Optical Link Organization (POLO) module is depicted in Fig. 2 [18]- [20]. In the POLO-1 and POLO-2 modules, waveguides formed from DuPont's polyguide photopolymer connect 62.5/125 m optical fibers to III-V VCSEL/PIN arrays, where 45 out-of-plane mirrors direct light to and from III-V components at terminal ends of the waveguides.…”

Section: Polylithic Integration: Overviewmentioning

confidence: 99%

Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication

Mule

Villalaz²,

Joseph³

et al. 2005

IEEE Trans. Adv. Packag.

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Polylithic integration of electrical and optical interconnect technologies is presented as a solution for merging silicon CMOS and compound semiconductor optoelectronics. In contrast to monolithic and hybrid integration technologies, polylithic integration allows for the elimination of optoelectronic and integrated optic device-related processing from silicon CMOS manufacturing. Printed wiring board-level and compound semiconductor chip-level waveguides terminated with volume grating couplers facilitate bidirectional optical communication, where fiber-to-board and board-to-chip optical coupling occurs through a two-grating (or grating-to-grating) coupling path. A 27% increase in the electrical signal I/O projected by and 33% increase in the number of substrate-level electrical signal interconnect layers implied by the International Technology Roadmap for Semiconductors (ITRS) projections for the 32-nm technology generation are required to facilitate 10 Tb/s aggregate bidirectional fiber-to-the-chip communication. Buried air-gap channels provide for the routing of chip or board-level encapsulated air-clad waveguides for minimum crosstalk and maximum interconnect density. Optical signals routed on-board communicate with on-chip volume grating couplers embedded as part of a wafer-level batch package technology exhibiting compatible electrical and optical input/output interconnects. Measurements of grating-to-grating coupling reveal 31% coupling efficiency between two slab, nonoptimized, nonfocusing volume grating couplers.

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Section: Polylithic Integration: Overviewmentioning

confidence: 99%

Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication

Mule

Villalaz²,

Joseph³

et al. 2005

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

show abstract

“…Interconnects can be copper or parallel optical cables. But compare to copper cables, parallel optics are favored for higher bandwidth, lower latency and extended link length beyond copper capabilities [3].…”

Section: Design Of a Scalable Hybrid Multicast Packet Switch With Optmentioning

confidence: 99%