IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)
DOI: 10.1109/iemt.2004.1321674
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Parallel test reduces cost of test more effectively than just a cheap tester

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Cited by 36 publications
(13 citation statements)
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“…In multi-site testing, many dies on a load-board or even on a wafer are tested in parallel by the same ATE [1], [2], [3], [4], [5]. All the dies receive identical input by the ATE, but the output side of the die-under-test cannot be handled in the same straightforward way, as the defective dies will respond in many different, unpredictable ways.…”
Section: Introductionmentioning
confidence: 99%
“…In multi-site testing, many dies on a load-board or even on a wafer are tested in parallel by the same ATE [1], [2], [3], [4], [5]. All the dies receive identical input by the ATE, but the output side of the die-under-test cannot be handled in the same straightforward way, as the defective dies will respond in many different, unpredictable ways.…”
Section: Introductionmentioning
confidence: 99%
“…In the digital domain, there has been many strides to parallelize tests because parallelization makes testing economical [3]. However, until recently, very little was done to parallelize measurements of analog DC quantities like currents and voltages.…”
Section: Introductionmentioning
confidence: 99%
“…To reduce these costs and the period of a cycle, it is preferable to increase the parallel test capacity of the probe card rather than to purchase the expensive Automatic Test Equipment (ATE) [1][2][3].…”
Section: Introductionmentioning
confidence: 99%