“…Other structural defects, such as through edge dislocation (TED) and through screw dislocation (TSD), cause surface pits and increase leakage current, which are less destructive. The main destructive defects are instant surface dislocation (BPD) defects and stacking faults (SF), which are likely to continuously increase the on-resistance of bipolar devices [ 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 ]. Surface defects, such as dump, scratch, particle, downfall (DF), triangle (TD), comet and carrot defects, are typically detrimental and easily observable, and often lead to device failure [ 36 , 37 , 38 , 39 , 40 , 41 , 42 ].…”