Partially Bonded Bimaterial Plane Under Tension

Abstract

A bimaterial problem is considered for shapes that are symmetrical with respect to an interface that is finite and straight. A rational mapping function and complex stress functions are used to obtain a general solution for bonded halfplanes with cracks at an end of the interface. A stress analysis is carried out for a state of uniform tension at infinity, which is either symmetrical or antisymmetrical with respect to the interface. Stress distributions and stress-intensity factors are obtained for various crack length and elastic constants. When one material is in tension and the other is free from traction, stress-intensity factors are also investigated. The bond effects on the stress-intensity factors are studied. The elastic constant's effects on the stress-intensity factor for a short crack and the stress function for special material constants are also investigated.

Solution of bonded bimaterial problem of two interfaces subjected to concentrated forces and couples

“…After that, the following researches are carried out . The solutions of bimaterial problem of one interface have been reported for bonded semi‐infinite planes subjected to uniform tension , couples , and for bonded strips subjected to temperature .…”

Green’s functions for a bi-material problem with interfacial elliptical rigid inclusion and applications to crack and thin rigid line problems

“…doi:10. 1016/j.ijsolstr.2004.07.014 bi-material interface due to external loads (Williams, 1959;Rice and Sih, 1965;Erdogan, 1965;England, 1965;Hasebe et al, 1990Hasebe et al, , 1992. Though there are some anomalies associated with interface crack problems, like oscillatory stress fields and crack face interpenetrations, they are confined to a small region surrounding the crack tip and can be neglected as shown by Rice (1988).…”