We investigate the role of the silicon surface and orientation on double‐sided TOPCon solar cells properties. The solar cells of front and rear, (p) and (n), poly‐Si/SiOx stack, fabricated on polished surfaces oriented 〈100〉 and 〈111〉 and pyramid textured surfaces, are characterized as a function of the thickness of an ultrathin SiOx layer, controlled at atomic scale from one‐ to four‐cycle atomic layer deposition (ALD). Our findings underline that the optimized thickness of the ultrathin SiOx is about 1.1 ± 0.1 nm, corresponding to a two‐cycle ALD, regardless of the surface and orientation of the c‐Si substrate. The open‐circuit voltage is about 10 mV higher on the polished 〈100〉‐oriented surface, associated with lower defect density at the interface of SiOx/c‐Si. On the other hand, the contact resistance is much lower, about 0.45 Ω/cm2, on the polished 〈111〉‐oriented surface. On textured surfaces, we demonstrate a photoconversion efficiency of 19.1% for the double‐sided TOPCon structure strictly for a SiOx thickness with two‐cycle ALD, which underlines the importance of the ALD technique for the precise control of the ultrathin SiOx thickness on textured surface.