Passivation and corrosion of microelectrode arrays

Schmitt, Guenter; Schultze, J.W.; Faßbender, F; Buß, G; Lüth, H.; Schöning, M. J.

doi:10.1016/s0013-4686(99)00094-8

Cited by 93 publications

(42 citation statements)

References 37 publications

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“…A wide variety of common problems that affect silicon-based micromachined devices when used in electrolyte solutions was documented and explained by Schmitt et al [27]. Problems were generally attributed to insuf®cient barrier properties and poor corrosion resistance of common passivation layers.…”

Section: Fabrication Shortcomingsmentioning

confidence: 99%

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Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

2000

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The wider availability of microlithographic techniques for the fabrication of electrochemical devices has led to a significant increase in the development of microfabricated arrays of microelectrodes and their use in a wide variety of analytical problems. The major microfabrication steps and the capabilities and limitations of this microsensor technology are reviewed in this article. Several examples are summarized to illustrate the breadth of work with silicon‐based microelectrode arrays, with special emphasis on their use for environmental analysis in a range of diverse settings including remote electroanalysis on Mars.

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Section: Fabrication Shortcomingsmentioning

confidence: 99%

“…The failure in this case was attributed to penetration of Cl À through the insulating layer and its subsequent reaction with the Al interconnect traces. It was recommended that locating the traces inside the thermal SiO 2 layer and substituting gold for aluminum can prevent such failure of a microfabricated devices [27,28].…”

Section: Fabrication Shortcomingsmentioning

confidence: 99%

Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

2000

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“…[1,2] Thus, for example, they are widely used in very large scale integration (VLSI) technology, [3,4] as anticorrosion protective layers, [5] hydrophobic coatings, [6] and passivation layers. [7] A common method of preparation of these thin films is PECVD.…”

Section: Introductionmentioning

confidence: 99%

Plasma Characterization of Oxygen‐Tetramethylsilane Mixtures for the Plasma‐Enhanced CVD of SiO_xC_yH_z Thin Films

Yanguas‐Gil

Barranco

Cotrino

et al. 2006

Chemical Vapor Deposition

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The plasma-enhanced (PE)CVD of SiO x C y H z thin films from O 2 /Ar/tetramethylsilane (TMS) mixtures, in a low-pressure microwave electron cyclotron resonant (ECR) plasma reactor, has been studied. The discharge has been analyzed by mass spectrometry (MS) and optical emission spectroscopy (OES) for varying amounts of oxygen in the gas mixture both in the presence and in the absence of argon. The films obtained have been characterized by Fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS). It is found that the electron impact of the TMS molecules and their dissociative ionization play an important role in the deposition process. Si(OH) x (CH 3 ) 3-x species, produced by reactions between the Si(CH 3 ) 4 molecule and Si(CH 3 ) 3 + ion fragments with O and O 2 , have been identified as important reaction intermediates.Such species form in different proportions depending on the O 2 /TMS ratio in the gas mixture. It is proposed that their incorporation onto the surface of the growing films accounts for the wide range of compositions achieved (ranging from SiO 2 to almost Si:C:H) and the high concentration of Si-C bonds experimentally detected in the SiO x C y H z thin films.

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“…We could attribute this to the lamination of the band electrode. Lamination is one of the defect or failure mode that normally occurs in silicon based microsensors [21,22]. As have been reported, non-uniform current densities on the electrode surface can contribute on electrodes damage [23,24].…”

Section: Figurementioning

confidence: 93%

Fabrication and characterization of microfabricated on-chip microelectrochemical cell for biosensing applications

Said¹,

Twomey²,

Herzog³

et al. 2017

AIP Conference Proceedings

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Passivation and corrosion of microelectrode arrays

Cited by 93 publications

References 37 publications

Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

Plasma Characterization of Oxygen‐Tetramethylsilane Mixtures for the Plasma‐Enhanced CVD of SiO_xC_yH_z Thin Films

Fabrication and characterization of microfabricated on-chip microelectrochemical cell for biosensing applications

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Passivation and corrosion of microelectrode arrays

Cited by 93 publications

References 37 publications

Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

Microfabricated Ultramicroelectrode Arrays: Developments, Advances, and Applications in Environmental Analysis

Plasma Characterization of Oxygen‐Tetramethylsilane Mixtures for the Plasma‐Enhanced CVD of SiOxCyHz Thin Films

Fabrication and characterization of microfabricated on-chip microelectrochemical cell for biosensing applications

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Plasma Characterization of Oxygen‐Tetramethylsilane Mixtures for the Plasma‐Enhanced CVD of SiO_xC_yH_z Thin Films