2006
DOI: 10.1002/cvde.200606496
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Plasma Characterization of Oxygen‐Tetramethylsilane Mixtures for the Plasma‐Enhanced CVD of SiOxCyHz Thin Films

Abstract: The plasma-enhanced (PE)CVD of SiO x C y H z thin films from O 2 /Ar/tetramethylsilane (TMS) mixtures, in a low-pressure microwave electron cyclotron resonant (ECR) plasma reactor, has been studied. The discharge has been analyzed by mass spectrometry (MS) and optical emission spectroscopy (OES) for varying amounts of oxygen in the gas mixture both in the presence and in the absence of argon. The films obtained have been characterized by Fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (X… Show more

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Cited by 22 publications
(22 citation statements)
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“…[20,21] Basically, they consist of a series of emission lines involving the 4s-4p and 4s-5p excited states of Ar. The spectrum is significantly modified when the dye molecules are being evaporated over the substrate.…”
Section: Oes Investigation Of the Plasma During Thin Film Depositionmentioning
confidence: 99%
“…[20,21] Basically, they consist of a series of emission lines involving the 4s-4p and 4s-5p excited states of Ar. The spectrum is significantly modified when the dye molecules are being evaporated over the substrate.…”
Section: Oes Investigation Of the Plasma During Thin Film Depositionmentioning
confidence: 99%
“…These electron transport coefficients were produced from reliable sets of electron collision cross section for TMS, BF 3 and N 2 molecules. Moreover, the remarkable synergism in the Townsend first ionization coefficient in the TMS-N 2 mixtures was also found out.…”
Section: Resultsmentioning
confidence: 99%
“…Tetramethylsilane (TMS), Si(CH 3 ) 4 , boron trifluoride (BF 3 ) and N 2 molecules in the form of pure are widely used in plasma processing such as plasma etching, plasma-enhanced chemical vapor deposition and doping plasma [1]- [8]. Moreover, these gases are not only used in the form of pure but also used in the form of mixtures with other gases depending on requirement of specific application.…”
Section: Introductionmentioning
confidence: 99%
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