Solution
processing of thin film encapsulation (TFE) has been a
long anticipated technology to bridge the big idea of flexible organic
electronics to become real world values, since only small-sized flexible
devices are currently achieved with expensive multilayered TFE by
complex vacuum processing. Highly demanding conditions are to carry
out the process under inert gas, at a low temperature, and without
aggressive chemicals to avoid damages to the organic materials. Here
we show for the first time a solution-processed TFE to totally equal
the level of conventional glass-cap encapsulation to achieve a “ready-to-be-used”
stability of an organic light emitting diode (OLED). A seamless organic/inorganic
multilayer in a structure such as polydimethylsiloxane (PDMS)/SiO
x
/SiN
y
/SiO
x
N
y
with a built-in
compositional gradient, as we named “PONT”, was achieved
by a combination of two Si-based polymer coatings, UV-curable PDMS,
perhydropolysilazane (PHPS), and their photochemical conversion under
irradiation of vacuum ultraviolet (VUV) light (λ = 172 nm) in
an N2-filled glovebox at room temperature. PDMS precursors
diluted with decamethylcyclopentasiloxane were directly coated to
OLED to form a protective layer. The presence of soft, elastic PDMS
and its surface conversion to SiO
x
to
improve wetting resulted in strong adhesion at the interfaces and
relaxed strain to avoid cracks in ultrathin and high density SiO
x
N
y
to serve as
a perfect barrier. A remarkably low water vapor transmission rate
<10–4 g/m2/day was confirmed for a
single PONT as thin as 280 nm. Standardized OLED devices with PONT
TFEs have proven 3,864 and 528 h stability under atmospheric (25 °C,
50% relative humidity (RH)) and accelerated (60 °C, 90%RH) degradation
tests, respectively, without formation of nonemissive dark spots in
OLEDs. The fast processing of PONT TFE can be applied to roll-to-roll
fabrication of various organic devices at low cost and in large areas,
since direct solution coating as well as VUV irradiation do not cause
any noticeable damages to sensitive organic materials.