PEC Reliability in 3D E-beam DOE Nanopatterning.

Krátký, Stanislav; Urbánek, Michal; Kolařík, Vladimír

doi:10.1017/s1431927615013422

Cited by 5 publications

(1 citation statement)

References 5 publications

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“…The mainstream micro/nano processing technologies include optical exposure technology [ 14 ], ion beam [ 15 , 16 ], electron beam lithography [ 17 , 18 ], nano-imprint technology [ 19 ], etching technology, 3D extrusion printing [ 20 ], electrochemical machining [ 21 ], femtosecond laser direct writing technology (FsLDW) [ 22 , 23 , 24 , 25 ] and so on. Among them, FsLDW and 3D printing technology can perfectly adapt to the preparation of photonic jumper wire because of their flexible customizability.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond Laser Direct Writing of Optical Overpass

et al. 2022

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With the rapid increase in information density, problems such as signal crosstalk and crossover restrict the further expansion of chip integration levels and packaging density. Based on this, a novel waveguide structure—photonic jumper wire—is proposed here to break through the technical restrictions in waveguide crossing and parallel line wrapping, which hinder the integration of photonic chips. Furthermore, we fabricated the optical overpass to realize a more complex on-chip optical cross-connection. Our method and structure promote a series of practical schemes for improving optical chip integration.

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