1992
DOI: 10.1007/bf00741420
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Penetration and adhesion behaviour of boron nitride by liquid aluminium

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Cited by 17 publications
(7 citation statements)
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“…3. According to Xue et al [15], h-BN can hardly be wetted by pure aluminum until at about 1225 K. Hence, it seems impossible to form AlN and AlB 2 from the original Al/BN mixture at the annealing temperature, and this point of view was also confirmed by Du et al [8]. The equilibrium diagrams [16] of Al-B and Al-N indicate an ignorable solubility of boron and nitrogen in aluminum at room temperature.…”
Section: Resultsmentioning
confidence: 66%
“…3. According to Xue et al [15], h-BN can hardly be wetted by pure aluminum until at about 1225 K. Hence, it seems impossible to form AlN and AlB 2 from the original Al/BN mixture at the annealing temperature, and this point of view was also confirmed by Du et al [8]. The equilibrium diagrams [16] of Al-B and Al-N indicate an ignorable solubility of boron and nitrogen in aluminum at room temperature.…”
Section: Resultsmentioning
confidence: 66%
“…For the A1-BN system, there is no solubility between aluminium and BN, therefore the formation of the interface is determined by the chemical reaction with each other. In the study of EPMA and XRD for the interface of A1-HP-BN and A1-CVD-BN, we noted that a stable interfacial reaction layer formed of A1N and aluminium boride, between liquid aluminium and boron nitride [7,8]. The reaction layer retarded the further reaction between liquid aluminium and boron nitride, so the temperature of the "nonwetting-wetting" transition of A1 BN is higher than that of A1-SiC.…”
Section: Wettabilitymentioning
confidence: 91%
“…Since a stable interface formed in the AI BN system and there existed a layer of A1N on the bottom of liquid A1 drop [7,8], when the system reached thermodynamic equilibrium, i.e. the wetting angle constant, the surface energy of liquid A1 (YIv~A~)), the surface energy of solid BN (7s~BN)) and the interfacial energy of liquid Al-solid A1N (YsI(AI/AIN)) could be given by Young's equation as follows ~ts(BN) : ~sI(AI/AIN) + "YIv(AI) COS 0 (1)…”
Section: Interfacial Energy and Surface Energymentioning
confidence: 99%
“…[11][12][13][14][15][16] Therefore, a further behavior is summarized in a schematic diagram in Figure 15. [11][12][13][14][15][16] Therefore, a further behavior is summarized in a schematic diagram in Figure 15.…”
Section: A Infiltration Behavior B Tensile Propertiesmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9][10] For the pressureless infiltration in this process, both nitro-Many kinds of ceramic phases have been added as a gen and Mg are needed. [13][14][15][16][17][18] matrix content similar to 6061, fabricated by pressureless infiltration. ), carbides ing the matrix of Al composites in this process, is influenced (SiC, TiC, B 4 C, etc.…”
Section: Introductionmentioning
confidence: 99%