“…These "8" silicon wafers were diced into 2 × 2 cm 2 pieces and used as Si substrates. 1-(5,5,6,6,7,7,8,8,9,9,10,10,10-Tridecafluorodecyl)-1H-pyrrole-2,5-dione (R F MI6), 20 4-hydroxystyrene (HOST), 27 4-cyano-4-[(dodecylsulfanylthiocarbonyl)sulfanyl]pentanoic acid (CDSTSP), 28 and nonafluorobutanesulfonyloxy-1,8-naphthalimide (NI-Nf) 29 were prepared as previously described.…”