Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Peng, Chih Wei; Lin, Jujian; Lin, Cheng‐Hsiung; Chiang, Kuo‐Ning

doi:10.1016/j.sna.2004.08.013

Cited by 55 publications

(24 citation statements)

References 5 publications

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“…In developing the FE model, the following assumption is made: the total stress applied to each piezoresistor is the sum of the average stresses acting on each of the elements within it [13,14]. With the data of dynamic mechanical analysis (DMA) and thermal mechanical analysis (TMA) examinations, the material properties of the molding compound employed in this study are described below.…”

Section: Fe Model Of the Packagementioning

confidence: 99%

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Chen

Cheng

2009

Sensors and Actuators A: Physical

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Section: Fe Model Of the Packagementioning

confidence: 99%

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Chen

Cheng

2009

Sensors and Actuators A: Physical

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“…Generally, silicon or polysilicon based piezoresistors are used in pressure sensor because of well-established fabrication processes for realizing the sensors. Silicon piezoresistors show a better sensitivity compared to polysilicon based piezoresistors (Peng et al 2005). However, silicon piezoresistors are isolated by a p-n junction from the bulk and thus cannot be used above 125 °C due to Abstract Piezoresistive sensing is one of the most frequently used transduction mechanism in pressure sensors.…”

Section: Introductionmentioning

confidence: 99%

Effect of piezoresistor configuration on output characteristics of piezoresistive pressure sensor: an experimental study

Kumar

Pant

2015

Microsyst Technol

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“…Besides the analytical efforts, the temperature-dependent behavior of a packaged MEMS was mostly simulated using FEM. The simulation covers a wide variety of devices, including resonators (De Anna et al 1999), accelerometers (Li and Tseng 2001;Zhang and Tee 2004;Zhang et al 2007), pressure sensors (Chiou 2003;Meyyappan et al 2003;Krondorfer et al 2004;Peng et al 2005;Lee et al 2006), etc., and the packaging scheme includes dual-in-package, ball grid array, chip scale package, chip on board, flip chip on board, etc. Most of the simulations were conducted in combination with experiments and prototype tests.…”

Section: Introductionmentioning

confidence: 99%

Influence of environmental temperature on the dynamic properties of a die attached MEMS device

Song

Huang

et al. 2009

Microsyst Technol

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Die attach is one of the major processes that may induce unwanted stresses and deformations into micro-electro-mechanical systems (MEMS). The thermoelastic coupling between the die and package may affect the performance of MEMS under various temperature loads, causing unreasonable effects of the output signal, such as zero offset, temperature coefficient of offset (TCO), nonlinearity, ununiformity and hysteresis, etc. A complete characterization of these effects is critical for a more reliable design. This work presents experimental studies of the temperature effects on the dynamic properties of MEMS. Microbridges and strain gauges with different dimensions were used as test structures. They were surface-micromachined on test chips and the chips were die attached on organic laminate substrates using epoxy bonding as well as tape adhering. The material and dimension of the substrate were specially defined to amplify the magnitude of the coupled deformation for the convenience of investigation. Modal frequencies of the microbridges under a set of controlled environmental temperature before and after die attach were measured using a laser Doppler vibrometer system. The average initial residual strain was also measured from the strain gauges to help analyze the dynamic behavior. Nonlinear TCO of the frequencies were observed to be as large as 2,500-5,000 ppm for the epoxy-bonded samples, in contrast with much smaller values for the tape-adhered and unpackaged ones. The frequencies recovered to their original values beyond the curing temperature of the epoxy. A distributed feature was also observed in frequencies of the microbridges with the same length but at different locations of the chip with a maximum relative difference of 20%. The process of thermal cycling and wire bonding was also applied to the samples and caused tender shifts of the frequencies. The experiments reveal major factors that are related to the temperature effects of die attached MEMS and the results are useful for improving the reliability of a package-device co-design.

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Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Cited by 55 publications

References 5 publications

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Effect of piezoresistor configuration on output characteristics of piezoresistive pressure sensor: an experimental study

Influence of environmental temperature on the dynamic properties of a die attached MEMS device

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