Performance and reliability of TIM in high power HFCBGA

Hu, Ian; Shih, Meng-Kai; Kao, Golden

doi:10.1109/impact.2015.7365218

Cited by 6 publications

(2 citation statements)

References 6 publications

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“…This gives a total of 12 equations with a total of 12 variables of (8) as shown at the bottom of the page 6. This gives a total of 12 equations with a total of 12 variables of…”

Section: Methods Descriptionmentioning

confidence: 99%

Monitoring of the Cooling System via Thermal Parameters

Zheng

Zhang

et al. 2019

IEEE Access

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The cooling system, including the thermal grease, heatsinks, plays an important role in the power converters for its reliable operation. While in the long-term operation situation, the cooling system will degrade with different kinds of failure mechanism of the components and finally result in the damage to the power converters. In this paper, the method was proposed to monitor the thermal network parameters of the cooling system using the cooling curves of junction temperature. By establishing the relationship between the RC parameters of Cauer network and time constants of cooling curves, the thermal parameters about cooling system can be obtained. Experimental tests are performed to verify the accuracy of proposed method. Results indicate the degradation state of the cooling system can be evaluated by monitoring the variation of thermal network parameters of the cooling system. INDEX TERMS Cauer thermal network model, cooling system, thermal network parameters.

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“…This gives a total of 12 equations with a total of 12 variables of (8) as shown at the bottom of the page 6. This gives a total of 12 equations with a total of 12 variables of…”

Section: Methods Descriptionmentioning

confidence: 99%

Monitoring of the Cooling System via Thermal Parameters

Zheng

Zhang

et al. 2019

IEEE Access

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“…The use of TIMs to reduce TCRs has been studied thoroughly in the field of electronics, as can be seen in the reviews presented in [1], [2], [3]. In addition, reference [4] presents a study on TIMs for high performance flip-chip-ball-grid arrays (HFCBGAs), whereas [5] conducts so for insulated gate bipolar transistors (IGBTs). Likewise, reference [6] summarizes the research on TIM reliability, with special interest in methodologies and results of several testing procedures.…”

Section: Introductionmentioning

confidence: 99%

Influence of Temperature and Aging on the Thermal Contact Resistance in Thermoelectric Devices

Rodríguez

Perez-Artieda

Beisti

et al. 2020

Journal of Elec Materi

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In the first phases of the development of thermoelectric systems, such as the thermoelectric generators, when the thermal design is carried out, the most important parameters affecting the performance are the thermal resistances of the components. This paper focusses on the thermal contact resistance (TCR), analyzing the influence of aging and temperature on different thermal interface materials (TIM), i.e., thermal paste, graphite and indium. In previous papers, TCR has been studied depending on parameters such as surface roughness, bonding pressure, thermal conductivity and surface hardness. However, in thermoelectric applications, a relevant aspect to consider when choosing a TIM is aging due to thermal stress. The exposure of this type of materials to high temperatures for long periods of time leads to deterioration, which causes an increase in the thermal contact resistance which impairs the conduction of the heat flow. Therefore, there is a need to study the behavior of thermal interface materials exposed to temperatures typical in thermoelectric generators, to make a correct selection of the TIM. It has been observed that exposure temperatures of around 180 °C induce a significant increase in the thermal impedance of the three TIM's under study, although this effect is much more relevant for the thermal paste. The contact comprising steel, thermal paste and ceramic presents a 300% increase in the thermal impedance after 70 days of aging, whereas that exceeds 185% for the contact of aluminum, thermal paste and ceramic. In the tests with exposure temperature of 60 °C, there is no observed decrease in the thermal impedance.

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High Thermal Performance Package with Anisotropic Thermal Conductive Material

Yang

et al. 2017

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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Performance and reliability of TIM in high power HFCBGA

Cited by 6 publications

References 6 publications

Monitoring of the Cooling System via Thermal Parameters

Monitoring of the Cooling System via Thermal Parameters

Influence of Temperature and Aging on the Thermal Contact Resistance in Thermoelectric Devices

High Thermal Performance Package with Anisotropic Thermal Conductive Material

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