2017
DOI: 10.1016/j.vacuum.2017.09.020
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Performance enhancement by plasma nitriding at low gas pressure for 304 austenitic stainless steel

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Cited by 36 publications
(23 citation statements)
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“…Baranowska [21] and Baranowska et al [27] reported a small nitrogen incorporation during cathodic sputtering, which can be explained taking into account the low pressure of the treatment (2-3 Pa), which causes a high sputtering rate. On the other hand, as previously recalled, it was reported that nitriding treatments performed in the range 80-160 Pa allow a significant nitrogen incorporation [3,13,14,17], suggesting that, in these conditions, nitrogen feeding is larger than sputtering.…”
Section: Discussionmentioning
confidence: 66%
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“…Baranowska [21] and Baranowska et al [27] reported a small nitrogen incorporation during cathodic sputtering, which can be explained taking into account the low pressure of the treatment (2-3 Pa), which causes a high sputtering rate. On the other hand, as previously recalled, it was reported that nitriding treatments performed in the range 80-160 Pa allow a significant nitrogen incorporation [3,13,14,17], suggesting that, in these conditions, nitrogen feeding is larger than sputtering.…”
Section: Discussionmentioning
confidence: 66%
“…As a consequence, ion and fast neutral energy increases, so that sputtering rate becomes considerable [26] and etching is deep. The high ion energy can also increase the number of active nitrogen atoms [13,14], which are able to diffuse into the substrate if the nitrogen feeding is not completely counteracted by sputtering. Baranowska [21] and Baranowska et al [27] reported a The untreated samples had passive corrosion behavior, with very low anodic current density values, which rapidly increased owing to the occurrence of localized corrosion phenomena when the potential was higher than about +407 mV (Ag/AgCl).…”
Section: Discussionmentioning
confidence: 99%
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“…Although detail information is not written in a few papers, relatively high-nitrogen surface content and formation of a nitrided layer with the thickness of 10-20 μm are common to those previous studies [31][32][33][34][35]. More precise analysis and discussion are needed to investigate the essential processes, governing the inner nitriding behavior at a lower temperature than 700 K. High-density RF-DC plasma systems [36][37][38][39][40] provides a new way to further analyze this low temperature plasma nitriding by experiments.…”
Section: Introductionmentioning
confidence: 99%