Performance evaluation of acid copper plating films for via filling

Microvia filling by copper electroplating using diazine black as a leveler

“…On the other hand, the intensity of [2 2 0] orientation peak obviously increased due to the addition of DB. A similar result was also found in other copper plating systems [54][55][56]. Honma et al [54] reported that the addition of a leveler in a plating bath causes the [2 2 0] orientation to be dominant.…”

“…A similar result was also found in other copper plating systems [54][55][56]. Honma et al [54] reported that the addition of a leveler in a plating bath causes the [2 2 0] orientation to be dominant. After annealing at 120 • C for 1 h, the [1 1 1] orientation rather than the [2 2 0] orientation becomes dominant [54].…”

“…Honma et al [54] reported that the addition of a leveler in a plating bath causes the [2 2 0] orientation to be dominant. After annealing at 120 • C for 1 h, the [1 1 1] orientation rather than the [2 2 0] orientation becomes dominant [54]. The change in the preferential orientation will lead to a change in the chemical activity of the surface copper atoms, which can be characterized by an etching test.…”

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

“…10, the diffraction pattern for the electroplating lm exhibits four important peaks at 43.2 , 50.3 , 73.9 , and 90.1 , which correspond to (111), (200), (220) and (311) of copper, respectively. Previous research [45][46][47] showed that the value of intensity ratios (111)/(220) decreased when leveler was added to an electroplating solution, so we do not discuss that here. From Fig.…”

Through-Hole Filling by Copper Electroplating

“…1 Of several microvia metallization technologies, copper electroplating has the most potential in the next generation to achieve a buildup process with microvias; 1 therefore, microvia filling of PCBs by copper electroplating has been comprehensively studied and successfully applied to fabricate PCBs with a highdensity interconnection ͑HDI͒. [1][2][3][4][5][6][7][8][9][10][11][12] HDI design in which a microvia is located on a plated through hole ͑PTH͒ has been extensively used in the fabrication of advanced buildup PCB. The microvia was metallized by copper electroplating in the bottom-up filling mode to fill the microvia completely without a void.…”