Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Zaimi, Nur Syahirah Mohamad; Salleh, Mohd Arif Anuar Mohd; Sandu, Andrei Victor; Abdullah, Mohd Mustafa Al Bakri; Saud, Norainiza; Rahim, Shayfull Zamree Abd; Vizureanu, Petrică; Said, Rita Mohd; Ramli, Mohd Izrul Izwan

doi:10.3390/ma14040776

Cited by 12 publications

(4 citation statements)

References 38 publications

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“…Tang et al [29] reported that the grain size of Cu 6 Sn 5 IMC increased with increasing reflow time, but the addition of TiO 2 suppressed the growth of the IMC due to TiO 2 particles preventing the diffusion between Cu and Sn atoms. It was also reported that the solder properties improved due to the enhancement in the growth of the interfacial IMC layer [20,24,26,30]. Therefore, it can be surmised that the growth of the IMC layers during multiple reflow soldering needs to be controlled or limited as it improves solder properties and ensures the reliability of the solder joints.…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, geopolymer ceramics consists of several elements such as Si and Al which may also contribute to the properties of the solder alloy. In our previous research [30,32] the effect of the addition of kaolin geopolymer ceramic (KGC) onto the properties of Sn-3.0Ag-0.5Cu (SAC305) under as-reflowed and isothermal aging conditions was investigated. The results confirmed that the addition of KGC as reinforcement particles in SAC305 enhanced its properties in as-reflowed and isothermal aging conditions.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

et al. 2022

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Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% kaolin geopolymer ceramics (KGC). The samples were fabricated using powder metallurgy with the hybrid microwave sintering method. Apart from using conventional cross-sectioned microstructure imaging, advanced synchrotron real-time in situ imaging was used to observe primary IMC formation in SAC305-KGC solder joints subjected to multiple reflow soldering. The addition of KGC particles in SAC305 suppressed the Cu6Sn5 IMC’s growth as primary and interfacial layers, improving the shear strength after multiple reflow soldering. The growth rate constant for the interfacial Cu6Sn5 IMC was also calculated in this study. The average growth rate of the primary Cu6Sn5 IMCs decreased from 49 µm/s in SAC305 to 38 µm/s with the addition of KGC particles. As a result, the average solidified length in the SAC305-KGC is shorter than SAC305 for multiple reflow soldering. It was also observed that with KGC additions, the growth direction of the primary Cu6Sn5 IMC in SAC305 changed from one growth to two growth directions. The observed results can be attributed to the presence of KGC particles both at grains of interfacial Cu6Sn5 IMCs and at the surface of primary Cu6Sn5 IMC.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

et al. 2022

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“…Even though HASL is the most popular method, it still uses lead in a significantly large portion [9]. To completely remove lead from the surface finish, pure tin plating has become the most popular option due to its good solderability and lower cost [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish

et al. 2021

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Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formation, which tends to endanger the efficiency of electronic circuits, and even worse, may cause short circuits to the electronic components. This research aims to investigate the effects of stress on tin whiskers’ formation and growth and the mitigation method for the immersion of the tin surface’s finish deposited on a copper substrate. The coated surface was subjected to external stress by micro-hardness indenters with a 2N load in order to simulate external stress applied to the coating layer, prior to storage in the humidity chamber with environmental conditions of 30 °C/60% RH up to 52 weeks. A nickel underlayer was deposited between the tin surface finish and copper substrate to mitigate the formation and growth of tin whiskers. FESEM was used to observe the whiskers and EDX was used for measuring the chemical composition of the surface finish, tin whiskers, and oxides formed after a certain period of storage. An image analyzer was used to measure the whiskers’ length using the JEDEC Standard (JESD22-A121A). The results showed that the tin whiskers increased directly proportional to the storage time, and they formed and grew longer on the thicker tin coating (2.3 μm) than the thin coating (1.5 μm). This is due to greater internal stress being generated by the thicker intermetallic compounds identified as the Cu5Sn6 phase, formed on a thicker tin coating. In addition, the formation and growth of CuO flowers on the 1.5 μm-thick tin coating suppressed the growth of tin whiskers. However, the addition of external stress by an indentation on the tin coating surface showed that the tin whiskers’ growth discontinued after week 4 in the indented area. Instead, the whiskers that formed were greater and longer at a distance farther from the indented area due to Sn atom migration from a high stress concentration to a lower stress concentration. Nonetheless, the length of the whisker for the indented surface was shorter than the non-indented surface because the whiskers’ growth was suppressed by the formation of CuO flowers. On the other hand, a nickel underlayer successfully mitigated the formation of tin whiskers upon the immersion of a tin surface finish.

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“…The performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing, resulting in the morphology of interfacial IMC layer of non-reinforced SAC305 and SAC305-KGC composite solder joints, showed a duplex IMC structure comprises of scallop-type Cu 6 Sn 5 and layer-type Cu 3 Sn [14].…”

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confidence: 99%

Obtaining and Characterization of New Materials

Sandu

2021

Materials

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Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Cited by 12 publications

References 38 publications

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish

Obtaining and Characterization of New Materials

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