2001
DOI: 10.1016/s0925-4005(01)00756-0
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Performance of Zr and Ti adhesion layers for bonding of platinum metallization to sapphire substrates

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Cited by 53 publications
(23 citation statements)
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“…That is, the transition may still exist but occur (as a sudden increase of the resistance) at a H 2 concentration which may be out of the upper limit of 2 % in the experiments by Kim et al [12]. Since Ti has been widely used to form a buffer (or adhesion) layer for metal films deposited on oxide substrates [13][14][15], further experiments on the effect of a Ti buffer layer on the phase transition in Pd/H system not only will be crucial for achieving H 2 sensors with a wide detection range but also can stimulate exploration on new phenomena in Ti-buffered metal systems.…”
Section: Introductionmentioning
confidence: 99%
“…That is, the transition may still exist but occur (as a sudden increase of the resistance) at a H 2 concentration which may be out of the upper limit of 2 % in the experiments by Kim et al [12]. Since Ti has been widely used to form a buffer (or adhesion) layer for metal films deposited on oxide substrates [13][14][15], further experiments on the effect of a Ti buffer layer on the phase transition in Pd/H system not only will be crucial for achieving H 2 sensors with a wide detection range but also can stimulate exploration on new phenomena in Ti-buffered metal systems.…”
Section: Introductionmentioning
confidence: 99%
“…The foil pieces also have 7 mm diameter holes cut in them to reduce stress on the diaphragm during bonding. After the diaphragm and back cavity are bonded, a 20 nm titanium layer is sputter deposited on the back side of the diaphragm to serve as an adhesion layer 29 for the 200 nm of platinum sputtered under continuous vacuum which functions as the reflective layer for the fiber-optic lever.…”
Section: Sensor Fabricationmentioning
confidence: 99%
“…Films were grown to thicknesses ranging from 10 nm to 2 μm, but unless otherwise noted, the results shown in this paper are for films with 200 nm nominal thicknesses. The Pt-coated sapphire substrates, consisting of a 50 nm Pt layer over a 10 nm Zr adhesion layer [19], were used in order to minimize charging effects during X-ray photoelectron spectroscopy (XPS) measurements. Prior to SiAlON film deposition, the substrates were cleaned with acetone, isopropyl alcohol, and DI water, and then inserted into vacuum and exposed to an Ar + plasma generated by a 150 W, electron cyclotron resonance (ECR) source operating at 10 −4 Torr.…”
Section: Contents Lists Available At Sciencedirectmentioning
confidence: 99%