Peridynamic wetness approach for moisture concentration analysis in electronic packages

Diyaroglu, Cagan; Oterkus, Selda; Öterkuş, Erkan; Madenci, Erdogan; Han, Sungwon; Hwang, Y.N.

doi:10.1016/j.microrel.2017.01.008

Cited by 44 publications

(24 citation statements)

References 12 publications

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“…Thermomechanical modeling of microelectronic packages has been addressed in [74]. Another crucial issue regarding electronic components is their potential moisture absorption, leading to degradation whereby the PD wetness approach [71] can be utilized to predict moisture concentration in electronic packages.…”

Section: Electronicsmentioning

confidence: 99%

Peridynamics review

Javili

Morasata

Öterkuş

et al. 2018

Mathematics and Mechanics of Solids

248

109

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Peridynamics (PD) is a novel continuum mechanics theory established by Stewart Silling in 2000. The roots of PD can be traced back to the early works of Gabrio Piola according to dell’Isola et al. PD has been attractive to researchers as it is a non-local formulation in an integral form, unlike the local differential form of classical continuum mechanics. Although the method is still in its infancy, the literature on PD is fairly rich and extensive. The prolific growth in PD applications has led to a tremendous number of contributions in various disciplines. This manuscript aims to provide a concise description of the PD theory together with a review of its major applications and related studies in different fields to date. Moreover, we succinctly highlight some lines of research that are yet to be investigated.

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Section: Electronicsmentioning

confidence: 99%

Peridynamics review

Javili

Morasata

Öterkuş

et al. 2018

Mathematics and Mechanics of Solids

248

109

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“…The moisture diffusion equation given Equation (2) can be expressed in peridynamic form as [7] [ ] ( )…”

Section: Peridynamic Wetness Formulationmentioning

confidence: 99%

“…On the other hand, although the internal source approach is easier to implement, its convergence is reliant on the number of iterations in each time step. More recently, peridynamic theory (PD) [7,8] was utilized to determine moisture and wetness distribution in electronic packages for time-dependent saturated moisture concentration condition. This technique is suitable for treating discontinuities and does not require an iterative solution.…”

Section: Introductionmentioning

confidence: 99%

A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis

et al. 2018

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In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.

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“…. The results obtained with the ANSYS thermal, diffusion and coupled field elements are also compared against the peridynamic solution [5] for uniform and nonuniform temperature with equal and unequal solubility activation energy of materials 1 and 2. In the case of unequal solubility activation energy, material 2 has diffusion" elements present significant deviation from the other solutions.…”

Section: Fig 2 a Bar Composed Of Two Materialsmentioning

confidence: 99%

“…However, the convergence of this approach is highly dependent on number of iterations carried out during each time step. Also, Diyaroglu et al [5] applied peridynamics within the ANSYS framework to solve for wetness and moisture concentration in the presence of time dependent saturated moisture concentration without requiring iterative solution schemes.…”

Section: Introductionmentioning

confidence: 99%

A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS

Diyaroglu

Oterkus²,

Öterkuş³

2018

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS "diffusion" and "coupled field" elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS "coupled field" elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS "diffusion" element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.

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Peridynamic wetness approach for moisture concentration analysis in electronic packages

Cited by 44 publications

References 12 publications

Peridynamics review

Peridynamics review

A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis

A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS

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