2013 IEEE 4th Control and System Graduate Research Colloquium 2013
DOI: 10.1109/icsgrc.2013.6653290
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pH sensing characteristics of silicon nitride thin film and silicon nitride-based ISFET sensor

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Cited by 4 publications
(3 citation statements)
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“…Ultimately, material selection for pH sensing should consider the target pH range, fabrication techniques, and operating conditions to ensure optimal performance and reliability. In addition to all these metal oxides, physical-vapor-deposited nitrides, such as titanium nitride (TiN), silicon nitride (Si3N4), and aluminum nitride (AlN), have also been studied in the past decade to improve and develop very robust and cost-effective pH sensing electrodes/devices that offer higher thermal stability, mechanical strength, and compatibility with harsh environments [57][58][59][60]. Also, nanostructured films, comprising nanostructured metals or metal oxides, exhibit a large surface-to-volume ratio, enhancing…”
Section: Thin Film Ph Sensing Materials Types and Developmentmentioning
confidence: 99%
“…Ultimately, material selection for pH sensing should consider the target pH range, fabrication techniques, and operating conditions to ensure optimal performance and reliability. In addition to all these metal oxides, physical-vapor-deposited nitrides, such as titanium nitride (TiN), silicon nitride (Si3N4), and aluminum nitride (AlN), have also been studied in the past decade to improve and develop very robust and cost-effective pH sensing electrodes/devices that offer higher thermal stability, mechanical strength, and compatibility with harsh environments [57][58][59][60]. Also, nanostructured films, comprising nanostructured metals or metal oxides, exhibit a large surface-to-volume ratio, enhancing…”
Section: Thin Film Ph Sensing Materials Types and Developmentmentioning
confidence: 99%
“…Electronics 2021, 10,1585 Nernst limit by replacing the solid-state front gate with a room-temperature ionic l [19].…”
Section: Devices and Modelsmentioning
confidence: 99%
“…For material changes, the AlGaN/GaN heterojunction [9] and Si 3 N 4 [10] are used to replace silicon substrate, while Si 3 N 4 [10], Al 2 O 3 [11], Ta 2 O 5 [12,13] and many other metal oxides are used to replace SiO 2 as the sensitive layer of ISFETs. At the same time, many structures have been utilized to increase the sensitivity of ISFETs, which are compatible with the CMOS process [14].…”
Section: Introductionmentioning
confidence: 99%