Since
physical chemistry data were not available for a Cu–Al–Au
ternary system, physical chemistry analysis of this system was carried
out experimentally using scanning electron microscopy with energy-dispersive
spectroscopy (SEM-EDX) and differential thermal analysis (DTA) measurements.
The hardness, microhardness, and electrical conductivity as additional
data of the investigated alloys in the Cu–Al–Au system
were determined too. The shape memory effect, pseudoelasticity, biocompatibility,
good resistance to corrosion and fatigue, and resistance to bending
enable the application of Cu–Al–Au alloys to a large
number of medical products, such as orthopedic and dental implants,
products related to cardiovascular surgery, surgical instruments,
etc. SEM-EDX analysis confirmed the existence of solid solutions based
on copper, aluminum, and gold (Cu, Al, Au), β, ε, and
γ phases, as well as intermetallic compounds AuAl2, Al2Cu, and AlCu. The characteristic temperatures of
the phase transformation were determined by DTA. The results of hardness
and microhardness showed that the highest values were measured in
alloys whose composition included the γ phase.