2006
DOI: 10.1002/polb.20757
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Phase separation, porous structure, and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester

Abstract: Thermosetting blends of an aliphatic epoxy resin and a hydroxyl‐functionalized hyperbranched polymer (HBP), aliphatic hyperbranched polyester Boltorn H40, were prepared using 4,4′‐diaminodiphenylmethane (DDM) as the curing agent. The phase behavior and morphology of the DDM‐cured epoxy/HBP blends with HBP content up to 40 wt % were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). The cured epoxy/HBP blends are immiscible and exh… Show more

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Cited by 51 publications
(33 citation statements)
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“…Due to the intramolecular or intermolecular acid-base neutralization, the reactivity of piperazine, pyrazine, and pyridine moieties was reduced in the curing epoxy resins to provide the good latent properties. Based on the studies of the viscosity and E a measurement, the activity order of the thermally latent catalytic systems was estimated to be piperazine-2-carboxylic acid (6) > 3-aminopyrazine-2-carboxylic acid (4) > 3-piperazin-1-yl-propionic acid (7) > 2-pyrazinecarboxylic acid (2) > picolinic acid (5) > 2,3-pyrazinedicarboxylic acid (3).…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Due to the intramolecular or intermolecular acid-base neutralization, the reactivity of piperazine, pyrazine, and pyridine moieties was reduced in the curing epoxy resins to provide the good latent properties. Based on the studies of the viscosity and E a measurement, the activity order of the thermally latent catalytic systems was estimated to be piperazine-2-carboxylic acid (6) > 3-aminopyrazine-2-carboxylic acid (4) > 3-piperazin-1-yl-propionic acid (7) > 2-pyrazinecarboxylic acid (2) > picolinic acid (5) > 2,3-pyrazinedicarboxylic acid (3).…”
Section: Discussionmentioning
confidence: 99%
“…[1][2][3][4][5][6] Although the biphenyl type epoxy resins are of great advantage as highly reliable electronic molding compounds (EMC) with good adhesion and high toughness, and used as high filter loadings, their epoxy resin system has low storage stability at room temperature. As a result, latent catalysts were developed to improve the pot life at room temperature for biphenyl type epoxy resins.…”
mentioning
confidence: 99%
“…Guo et al [75] discovered that for the blend with a G4 hydroxyl functionalized HBP content up to 10 wt%, discrete HBP domains are dispersed in the continuous cured epoxy matrix. Guo et al [75] discovered that for the blend with a G4 hydroxyl functionalized HBP content up to 10 wt%, discrete HBP domains are dispersed in the continuous cured epoxy matrix.…”
Section: Blend Composition and Curing Agentmentioning
confidence: 99%
“…Hybrid material containing Boltorn H20 and SiO 2 -TiO 2 networks have been successfully prepared for toughening DGEBA epoxy resin, which can form ternary cured networks of DGEBA via a sol-gel process leading to an epoxy resin with a high modulus, impact strength and T g [19]. Q Guo et al [20] have studied the phase separation, porous structure, and cure kinetics thermosetting blends of an aliphatic epoxy resin and a hydroxyl-functionalized hyperbranched polymer (HBP). Based on detailed literature review the hybrid coatings prepared by using different alkoxysilane precursors and sol-gel techniques result in brittle coating films, however, the incorporation of alkoxysilane precursors in the polymer network through in situ methods and/or modification of reactive polymers with inorganic precursors are becoming increasingly important for the development of tough and flexible coatings.…”
Section: Introductionmentioning
confidence: 99%