The structural quality of GaAs/Si films can be improved by incorporating a Si interlayer. In this paper, we discuss the effect on the GaAs structural quality of a high-temperature anneal, either in situ between the deposition of the Si layer and subsequent GaAs, or ex situ after the film has been fully grown. The Si interlayer has been found to act as both a cap layer for an in situ high-temperature anneal and a blocking layer of dislocations. The full width at half maximum ͑FWHM͒ of the x-ray rocking curve of ͑400͒GaAs diffraction in 1-m-thick GaAs/Si films decreased from 625 to 388 s upon the incorporation of a Si interlayer. Furthermore, the FWHM was decreased to 200 s by adding an ex situ anneal at 900°C for 1 min after growth. However, it was found in GaAs/Si films with Si interlayers that a 78 meV acceptor level due to a Ga antisite defect was observed from photoluminescence ͑PL͒ at 77 K, and that oval defects were generated from secondary electron-microscope observations. These phenomena suggested in addition to the improved quality that the Si leads to a surface segregation of As, and that Ga droplets are left behind. It was also shown from both the PL peak-energy shift and the broadening of the PL linewidth that the layer structure of the Si interlayer would be destroyed through out-diffusion from Si during an ex situ anneal at temperatures greater than 950°C in GaAs/Si films.