Photonic Integration on an InP-Membrane

Tol, J.J.G.M. van der; Jiao, Yuqing; Shen, L.; Mejia, A.J. Millan; Ambrosius, H.P.M.M.; Smit, M.K.

doi:10.1364/iprsn.2016.itu2a.1

Cited by 4 publications

(4 citation statements)

References 7 publications

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“…The fabrication of a CAO-Rx relies on an InP membrane platform which allows for integration of a broad range of photonic components with high efficiency and high speed [29], [30]. Inherited from the generic InP-based platforms [31], [32], the InP membrane platform contains an active-passive InP photonic layer with extra advantages, such as high optical confinement, flexible layer stack and strongly reduced parasitics.…”

Section: A Inp Membrane Photonic Integration Platformmentioning

confidence: 99%

“…The small active structure results in very short taper length for power transfer between active and passive waveguides. Together with monolithically integrated passive components [30], such as multimode interference (MMI) couplers and arrayed waveguide gratings (AWG) for WDM, the CAO-Rx with more functions can be realized.…”

Section: A Inp Membrane Photonic Integration Platformmentioning

confidence: 99%

“…It is fabricated using a double-sided processing scheme, which is a unique technology of the membrane platform. It gives rise to significant optimization of the device performance [29], [30].…”

Section: B Design and Fabrication Of Cao-rxmentioning

confidence: 99%

See 2 more Smart Citations

Ultrahigh Throughput Indoor Infrared Wireless Communication System Enabled by a Cascaded Aperture Optical Receiver Fabricated on InP Membrane

Cao

Jiao

Shen

et al. 2018

J. Lightwave Technol.

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Section: A Inp Membrane Photonic Integration Platformmentioning

confidence: 99%

Section: A Inp Membrane Photonic Integration Platformmentioning

confidence: 99%

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Ultrahigh Throughput Indoor Infrared Wireless Communication System Enabled by a Cascaded Aperture Optical Receiver Fabricated on InP Membrane

Cao

Jiao

Shen

et al. 2018

J. Lightwave Technol.

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“…An optical link implemented on a III-V/siliconon-insulator (III-V/SOI) platform using an electro-absorption modulator achieved high-speed operation with a 3-dB bandwidth of 13 GHz [16]. A twin-guide laser and a uni-carrier travelling photodiode integrated with InP-membrane circuit were demonstrated [17]. By employing a directly modulated on-chip light source, a reduction of the laser current results in a reduction in the total consumed link energy.…”

Section: Introductionmentioning

confidence: 99%

Integrated Optical Link on Si Substrate Using Membrane Distributed-Feedback Laser and p-i-n Photodiode

Inoue¹,

Hiratani²,

Fukuda³

et al. 2017

IEEE J. Select. Topics Quantum Electron.

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On-chip optical interconnection is a promising technology for wiring future large-scale integrated circuits, as a means to mitigate the considerable power dissipation of traditional wiring layers. Here, we fabricate an integrated optical link using a membrane distributed-feedback (DFB) laser and a p-i-n photodiode (PD) in a butt-jointed built-in coupling geometry. The optical link is formed on a Si substrate by benzocyclobutene bonding. The integrated DFB laser shows a low-threshold current of 0.48 mA. Light transmission between the DFB laser and the p-i-n PD is confirmed with static measurements of the optical link. The optical link has a 3-dB bandwidth of 11.3 GHz at a 2.73 mA DFB laser bias current and a -3 V p-i-n PD bias voltage. A data transmission experiment of the optical link is performed, using a nonreturn to zero, pseudorandom-bit-sequence with a word length of 2 31 -1 signals. With a DFB laser bias current of 2.5 mA, 10 Gbit/s data transmission with a bit-error-rate of 6 × 10 -7 is successfully achieved.

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