The wafer-scale integration of the downscaled devices such as transistors based on two-dimensional (2D) transition metal dichalcogenide (TMD) has attracted great attention in recent years. Such integration is also a significant step towards the system-level application of these novel lowdimensional semiconductors. Yet, so far, functional logic circuits based on the 2D TMDs have rarely been reported, largely because of the absence of an effective approach for large-scale TMD synthesis and the unsatisfactory elementary logic cell performance. In this work, n-type inverter (NOT gate circuit) arrays have been fabricated based on a wafer-scale 2D molybdenum disulfide (MoS 2 ) thin film which is grown by atomic layer deposition (ALD). High-quality crystallinity and excellent wafer-level uniformity have been successfully achieved. The n-type inverter array exhibits a fast response with 50 Hz inverse-frequency. The impact of the device geometry on the inverter performance has also been characterized by designing various width ratio between the load and pull-down transistors. These results open up an attractive approach to realize the practical application of wafer-scale 2D MoS 2 in logic and circuit systems.Nanoelectronic devices built on two-dimensional (2D) materials, such as semiconducting transition metal dichalcogenides (TMDs), [1][2][3] silicene, [4] black phosphorus, [5] and so forth are considered as promising candidates for the next-generation high-mobility and low-power electronics which is currently dominated by low-mobility amorphous silicon. [6] MoS 2 , a typical TMD semiconductor, has been widely studied due to its unique material properties and promising applications in various fields including photonics, [7][8][9] sensing, [10] field-effect transistor (FET)based nanoelectronics, [2,[11][12][13] and so on. As compared with conventional Si material in an ultra-scaled FET, the 2D MoS 2 can enable excellent electro-static gate control suppressing shortchannel effects while maintaining good semiconductor features and decent mobility. [14,15] Although the researches focusing on TMD materials and devices have been emerging in a large quantity since the first report on MoS 2 FET in 2011, [2] the circuit-level applications have been bottlenecked for a long time by the limited approaches to effectively prepare high-quality and large-area TMD thin films. Lately, a complementary MoS 2 inverter based on fin-shaped structure has been reported by using ion implantation to form p-type MoS 2 , which however is not highly reproducible to fabricate largearea and high-quality TMD thin films. [16]