Photosensitive Polyimides with Rigid Side Chain and Their Thermal Stable Liquid-Crystal Alignment Properties

Im, Ji Hyuk; Chae, Boknam; Lee, Seung Hun; Bae, Jun; Seo, Hye Mi; Jung, Jae Hak; Lee, Seung Woo

doi:10.1080/15421406.2014.940488

Cited by 2 publications

(1 citation statement)

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“…In recent years, photosensitive polyimide has been widely used as encapsulants or insulation material, such as buffer coating, passivation layer, shielding material, wafer packaging materials etc. The organic material polyimide can form a uniform surface morphology after treatment with suitable gas and temperature conditions, which can provide excellent performance as the insulating layer of a microcircuit [4][5][6][7][8][9][10][11][12][13][14][15][16] . The best heating rate of PI is 5 °C/min [5] .…”

Section: Introductionmentioning

confidence: 99%

Exploration of photosensitive polyimide as the modification layer in thin film microcircuit

et al. 2018

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Positive type photosensitive polyimide is used as the modification layer in the thin film transistors production process. The photosensitive polyimide is not only used as the second insulating layer, it can also be used instead of a mask because of the photosensitivity. A suitable curing condition can help photosensitive polyimide form the high performance polyimide with orderly texture inside, and the performance of imidization depends on the precise control of temperature, time, and heat control during the curing process. Therefore, experiments of different stepped up heating tests are made, and the ability of protecting silicon dioxide is analyzed.

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