The impact of the flexibility of photosensitive polyimide backbone on the properties of liquid-crystal alignment under non-polarised ultraviolet light

Wang, Fei; Zhu, Gang; Gong, Xinjian; Geng, Pengfei; Gao, Zhenwei; Wang, Yinghan

doi:10.1080/02678292.2020.1846091

Cited by 4 publications

(2 citation statements)

References 31 publications

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“…It is obvious to see that the reported PSPIs mostly focused on the development of photosensitive reagents and their combination with conventional thermally stable PI to formulate PSPI, but few studies have discussed the impact of chain rigid and film transparency on the performance of PSPI. For example, Zhu et al reported a series of studies on the structural design for PSPI‐based liquid crystal alignment films 25–28 . Fan et al presented the application of poly(amic ester) in PSPI 29 .…”

Section: Introductionmentioning

confidence: 99%

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Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Chang

Tseng

et al. 2023

Journal of Polymer Science

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Photosensitive polyimides (PSPIs) have been widely used in the buffer coating layer and insulation layer due to their excellent thermal and mechanical stability. In this work, a series of negative‐type PSPIs based on poly(amic acid) (PAA) and a photobase generator (PBG) have been developed. Two diamines of 4,4′‐oxydianiline (ODA), 3,3′‐diaminodiphenyl sulfone (SDA), and four dianhydrides of pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and cyclobutene‐1,2,3,4‐tetracarboxylic dianhydride (CBDA) are copolymerized to PAA through polyaddition, and the PAA is further thermally imidized to polyimide (PI). Through scrutinizing the structure–sensitivity relationship of these PIs, we find that the rigidity and transparency of the PAA/PI backbone play an important role in the sensitivity and contrast of PSPI. Accordingly, PSPI (SDA‐ODPA), possessing high optical transparency and a low rigidity represented by the low glass transition point, is capable of providing good photosensitivity of 30 mJ/cm2, a high contrast of 2.46, and an excellent pattern resolution of 4 μm after optimizing the prebaking (100°C for 5 min), exposure dose (380 mJ/cm2), post‐exposure baking (130°C for 7 min), and development parameters. This work provides the concept of structural design for negative‐type PSPI in the microelectronic application.

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Section: Introductionmentioning

confidence: 99%

“…For example, Zhu et al reported a series of studies on the structural design for PSPI-based liquid crystal alignment films. [25][26][27][28] Fan et al presented the application of poly(amic ester) in PSPI. 29 Song et al developed an intrinsic PSPI with the o-nitrobenzyl ether group.…”

Section: Introductionmentioning

confidence: 99%