2011 International Electron Devices Meeting 2011
DOI: 10.1109/iedm.2011.6131539
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Physical mechanisms of endurance degradation in TMO-RRAM

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Cited by 133 publications
(81 citation statements)
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“…Generally endurance phenomenon depends on different operation factors such as the environment temperature, device switching speed and also the material characteristics. Regarding this, three types of endurance failure behavior are reported in RRAM devices [9]. In the first mechanism the HRS resistance tends to decrease while the LRS resistance increases during cycles.…”
Section: B Endurancementioning
confidence: 99%
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“…Generally endurance phenomenon depends on different operation factors such as the environment temperature, device switching speed and also the material characteristics. Regarding this, three types of endurance failure behavior are reported in RRAM devices [9]. In the first mechanism the HRS resistance tends to decrease while the LRS resistance increases during cycles.…”
Section: B Endurancementioning
confidence: 99%
“…Fig.1 depicts this degradation mechanism and defines the final failure state of the device as the point that the HRS to LRS resistance ratio decrease reaches an arbitrary given ratio K. The second and third endurance mechanisms are due to the abrupt or gradual (respectively) drop of HRS value during the cycles and getting stuck at LRS value [9]. In this work, we focus on the first mechanism as it is considered the worst case [9,10]. Therefore, we analyze its impact in the reliability of a memristive crossbar memory.…”
Section: B Endurancementioning
confidence: 99%
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“…ENDURANCE MODEL Fig. 5 shows the effect of aging after a high number of operational cycles, phenomenon that causes a limitation in endurance [5]. This aging model indicates a gradual reduction of the HRS (and IRS) levels with cycling operations.…”
Section: Cycle-to Cycle Variabilitymentioning
confidence: 99%