Cryogenic CMOS is a crucial component in building scalable quantum computers, predominantly for interface and control circuitry. Further, high performance computing can also benefit from cryogenic boosters. This necessitates an in-depth understanding of the power and performance trade-offs in cryogenic operation of digital logic. In this paper, we analyze digital standard cells in 28nm High-K Metal Gate (HKMG) CMOS foundry Process Design Kit (PDK). We have developed BSIM4 models of cryogenic CMOS and calibrated with experimental measurements. Since, low temperature operation leads to an exponential decrease in the leakage current of the transistors, we further tune the threshold voltage of the devices to achieve iso-leakage. In this paper, we present inverter static and dynamic characteristics and multiple Ring Oscillator(RO) structures. The simulation study shows that we can achieve 28%(FO4-RO) -59%(NAND3-RO) higher performance under iso-VDD scenario and up to 90% improvement in the Energy Delay Product (EDP) under isooverdrive scenario at 6K compared to room temperature.