Piezoelectric Fans Using Higher Flexural Modes for Electronics Cooling Applications

Wait, Sydney M.; Basak, Sudipta; Garimella, Suresh V.; Raman, Arvind

doi:10.1109/tcapt.2007.892084

Cited by 84 publications

(36 citation statements)

References 16 publications

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“…A bending moment is induced at the interface of the cantilever beam and the piezoelectric element when a voltage is applied [14,15]. The beam is set into an oscillatory motion if an alternating voltage is applied, which then creates motion in the surrounding fluid; this motion has proved to provide heat transfer enhancements with minimal power consumption [16].…”

Section: List Of Symbols D Pzmentioning

confidence: 99%

Effects of tip gap and amplitude of piezoelectric fans on the performance of heat sinks in microelectronic cooling

et al. 2011

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Piezoelectric fan is a promising option for cooling microelectronic devices owing to its unique features such as no electromagnetic noise, low power consumption and minimum space requirement. The recent interest is to integrate the piezoelectric fans (piezofans) with heat sink; this idea is widely accepted and researches are still underway. This article presents experimental analysis on the effects of tip gap (d) and amplitude of piezofan vibration (a) on the heat transfer characteristics of finned heat sinks. Two heat sink configurations, namely A and B (with two and four fins respectively) each of which is arranged with three piezofans, are considered for the study. The transient temperature distributions for cases with and without piezofans are obtained for both the configurations, and compared. The heat transfer coefficient, thermal impedance, Nusselt number and Reynolds number are investigated as functions of d and a. The effect of a on the fan effectiveness is also analyzed. It is observed that the configuration B has better cooling performance compared to A. Among the tested ranges of d and a, the case with least tip gap (d = 0.03) and highest amplitude (a = 5.29) is found to be the best; at this setting, the fan effectiveness is increased to almost 4 times compared to the case without piezofans.

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Section: List Of Symbols D Pzmentioning

confidence: 99%

Effects of tip gap and amplitude of piezoelectric fans on the performance of heat sinks in microelectronic cooling

et al. 2011

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“…The maximum flow velocity close to the tip of foil can reach 3.0 m/sec at appropriate resonant frequency. Wait et al [4] measured the amplitudes of piezoelectric fan for higher resonance modes. The energy consumption and flow field were assessed for various foil lengths and resonant frequencies.…”

Section: Introductionmentioning

confidence: 99%

Numerical Investigation on the Flow Field Produced by Oscillating Foils

et al. 2017

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Abstract. In present manuscript, the flow field produced by oscillating foils in a duct were under investigation numerically. The flow field was considered as an incompressible laminar transient flow. In this paper, the oscillating frequencies were 2, 4 and 6 Hz; the span angles of the foil were 30˚, 60˚, 90˚, 120˚, and 150˚, respectively. The flow field produced by a particular oscillating pattern (fast forward slow backward, FFSB) has been made in comparison with that by the sinusoidal oscillating pattern. The flow field produced by dual oscillating foils was also analysed. Two foils oscillated in the same direction (in-phase) and in the opposite direction (counter-phase) were studied as well. Commercial software ANSYS-FLUENT was employed for the 2D numerical simulation. A moving grid technique was utilized in the analysis. Results present the flow average velocity increases as the oscillating frequency increases. It is also shown that the flow average velocity with span angle of 120˚ is the largest among these cases. In addition, the flow average velocity with dual foils is better than that with a single foil.

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“…Further increases of mode number incurred reductions of flow entrainment along with the diminished vortex around the fin, leading to the weaker vortex formation and the moderated impingement effect to suppress the cooling effectiveness [17]. As an active cooling device for thermal management, the relevant factors affecting the thermal performances of the piezofans, including the oscillating amplitude/frequency and fin geometry/arrangement [18,19], the materials [20] and resonance modes [21] of fins, and the optimum fin-positions against a heat sink [22] were previously examined. These works [17][18][19][20][21][22] utilized piezofans as the stand-alone cooling devices with the effective cooling region restricted in local areas [23].…”

Section: Introductionmentioning

confidence: 99%