Piezoresistive 4H-SiC Pressure Sensor With Diaphragm Realized by Femtosecond Laser

Wang, Lukang; Zhao, You; Yu, Yang; Pang, Xing; Hao, Le; Zhao, Yue

doi:10.1109/jsen.2022.3174046

Cited by 11 publications

(3 citation statements)

References 51 publications

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“…The excess SiC material was gradually removed layer by layer using the femtosecond laser until the desired depth of the blind hole was achieved, with the remaining membrane at the bottom serving as the diaphragm for the pressure sensor. The smoothness, flatness, sidewall inclination angle, and surface roughness of the diaphragm are important factors that influence the performance of the sensor [158][159][160]. The sensor was connected to a single-arm bridge for pressure sensor characterization experiments.…”

Section: Microelectromechanical Systemsmentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

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Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices.

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Section: Microelectromechanical Systemsmentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

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“…In contrast, 6H-SiC and 4H-SiC can be epitaxially grown to produce commercial wafers for different all-SiC devices, and relevant pressure sensors have attracted significant attention. Wang et al reported a serial of all-4H-SiC pressure sensors with a measurement range of 5MPa, in which the sensing diaphragm was produced via laser micromachining of the 4H-SiC wafer [ 75 , 76 , 77 ]. The experimental results showed that a low hysteresis error of 0.17%FS and nonlinearity of 0.20%FS could be achieved at room temperature.…”

Section: Contributions Of New Materialsmentioning

confidence: 99%

Structural Engineering in Piezoresistive Micropressure Sensors: A Focused Review

Liu¹,

Jiang

Yang³

et al. 2023

Micromachines

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The longstanding demands for micropressure detection in commercial and industrial applications have led to the rapid development of relevant sensors. As a type of long-term favored device based on microelectromechanical system technology, the piezoresistive micropressure sensor has become a powerful measuring platform owing to its simple operational principle, favorable sensitivity and accuracy, mature fabrication, and low cost. Structural engineering in the sensing diaphragm and piezoresistor serves as a core issue in the construction of the micropressure sensor and undertakes the task of promoting the overall performance for the device. This paper focuses on the representative structural engineering in the development of the piezoresistive micropressure sensor, largely concerning the trade-off between measurement sensitivity and nonlinearity. Functional elements on the top and bottom layers of the diaphragm are summarized, and the influences of the shapes and arrangements of the piezoresistors are also discussed. The addition of new materials endows the research with possible solutions for applications in harsh environments. A prediction for future tends is presented, including emerging advances in materials science and micromachining techniques that will help the sensor become a stronger participant for the upcoming sensor epoch.

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“…Recently, it was demonstrated that laser-based processing techniques can be widely used in the manufacture of pressure sensors due to the merit of low cost, clean and pollution-free [26][27][28][29][30]. For example, based on femtosecond laser micromachining, a piezoresistive bulk 4H-SiC pressure sensor with controllable diaphragm thickness was successfully developed, which maintains great output characteristics in a broad temperature range of −50 • C-300 • C under applied pressure of 0-5 MPa [26]. Highly customizable microstructures can be obtained rapidly and cost-effectively by irradiating hard materials with femtosecond laser self-channeling pulse [28,29].…”

Section: Introductionmentioning

confidence: 99%

Flexible, highly sensitive and reliable piezocapacitive pressure sensor with honeycomb-like microarchitecture fabricated using filament-processed mold

Zhang

Liu

et al. 2023

Smart Mater. Struct.

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Highly sensitive flexible pressure sensors have been extensively studied due to their promising applications in many fields. Various sensing mechanisms have been proposed to convert pressure into a readable electrical signal, among which piezocapacitive presents advantages due to its simple structure and convenient integration. The modification of the dielectric layer composing these sensors is a common strategy to improve their sensing performance. In this paper, we propose the fabrication of a novel capacitive-based flexible pressure sensor with honeycomb-like microarchitecture by using femtosecond laser filament based far-field technique. The fabricated flexible sensing device is assembled face-to-face with two layers of micro-structured polydimethylsiloxane (PDMS) thin films that is duplicated from laser filament-processed silicon mold. The as-prepared flexible sensor features excellent sensing performance with high reliability, and enables detection of multi-modal signals, including pressure, proximity, and bending. Owing to the advantages mentioned above, the obtained flexible pressure sensor can be attached on non-planar human skin to monitor the physiological signals as well as joint deformation during exercise, revealing it great application potential in cutting-edge fields, such as robotic tactility.

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Piezoresistive 4H-SiC Pressure Sensor With Diaphragm Realized by Femtosecond Laser

Cited by 11 publications

References 51 publications

A Review of Femtosecond Laser Processing of Silicon Carbide

A Review of Femtosecond Laser Processing of Silicon Carbide

Structural Engineering in Piezoresistive Micropressure Sensors: A Focused Review

Flexible, highly sensitive and reliable piezocapacitive pressure sensor with honeycomb-like microarchitecture fabricated using filament-processed mold

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