Placement Optimization of Flexible TFT Digital Circuits

Liu, Wei-Hsiao; Ma, En-Hua; Wei, Wen-En; Li, James Chien-Mo

doi:10.1109/ims3tw.2011.39

Cited by 3 publications

(24 citation statements)

References 5 publications

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“…Therefore, how to reduce the influence of mechanical strain has become one of the most critical issues in TFT technology. As indicated previously in Liu et al [2011], the impact of mechanical strain can be effectively alleviated if all the critical cells involved in the critical path are appropriately separated in a cell placement. The mobility variation caused by the change of mechanical strain can be represented by Equation (1), where μ 0 is the original mobility at room temperature (30 • C) and μ s is the mobility under an induced mechanical strain.…”

Section: Tft Technologymentioning

confidence: 99%

“…As a result, the cell placement problem in TFT circuits is different from traditional cell placement problem in digital/analog circuits, and traditional placement techniques are unsuitable to be applied to cell placement problem in TFT circuits. To reduce the impact of mechanical strain, a simulated annealing (SA)-based approach [Liu et al 2011] has been proposed to derive a better placement as shown in Figure 3 (b). Although this algorithm addresses the impact of mechanical strain, it does not consider the impact of temperature.…”

Section: Tft Technologymentioning

confidence: 99%

“…The first proposed placement optimization technique for flexible TFT, FlexiPlace [Liu et al 2011], is based on SA approximation to optimize an initial placement. In this approach, the initial position of each cell is randomly assigned.…”

Section: Simulated Annealing-based Flexible Tft Circuit Placementmentioning

confidence: 99%

“…Moreover, two kind of critical cell distribution techniques, the mathematical integer linear programming (ILP) model and minimum-cost maximum-flow (MCMF) model, are also developed to effectively alleviate the impact of mechanical strain and temperature on cell mobility. -Compared with the SA-based method [Liu et al 2011], the proposed approach can quickly and stably generate high-quality solutions without routing overhead.…”

Section: Our Contributionsmentioning

confidence: 99%

“…To demonstrate the effectiveness of the proposed algorithms, Table V and Table VI present a comparison of the two proposed distribution approaches with the SA-based approach [Liu et al 2011], where all experimental data in each column of Table V and Table VI are normalized and listed in the last row of the table labeled "Normal". Since Liu et al [2011] do not consider the impact of temperature, their program cannot report the information of temperature in the output file.…”

Section: Comparison Of Previous Work and This Work Based On Both Thermentioning

confidence: 99%

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Placement optimization of flexible TFT circuits with mechanical strain and temperature consideration

Lin

2014

J. Emerg. Technol. Comput. Syst.

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Mobility is the primary device parameter affecting circuit performance in flexible thin-film transistor (TFT) technologies, and is particularly sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the impact of mechanical strain in cell placement of flexible TFT circuits. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This article presents the first work to minimize the mobility variation caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively and efficiently reduce the increasing critical path delay. ACM Reference Format: Lin, J.-L., Wu, P.-H., and Ho, T.-Y. 2014. Placement optimization of flexible TFT circuits with mechanical strain and temperature consideration.

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Section: Tft Technologymentioning

confidence: 99%

Section: Tft Technologymentioning

confidence: 99%

Section: Simulated Annealing-based Flexible Tft Circuit Placementmentioning

confidence: 99%

Section: Our Contributionsmentioning

confidence: 99%

Section: Comparison Of Previous Work and This Work Based On Both Thermentioning

confidence: 99%

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Placement optimization of flexible TFT circuits with mechanical strain and temperature consideration

Lin

2014

J. Emerg. Technol. Comput. Syst.

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Printed Electronics: Effects of Bending and a Self-Compensation Means

Jia

Chang

2017

IEEE Trans. Circuits Syst. I

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Design, Automation, and Test for Low-Power and Reliable Flexible Electronics

Huang¹,

Huang²,

Cheng³

2015

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Flexible electronics are emerging as an alternative to conventional Si electronics for smart sensors, disposable RFID tags, and solar cells. By utilizing inexpensive manufacturing methods such as ink-jet printing and roll-to-roll imprinting, flexible electronics can be made on low-cost plastic films just like printing newspapers. However, the key elements of flexible electronics, thin-film transistors (TFTs), have slower operating speeds and are less reliable than their Si electronics counterparts. Furthermore, TFTs are usually mono-type -either p-or n-type -devices. Making air-stable complementary TFT circuits is very challenging or sometimes not feasible to most TFT technologies. Existing design methodologies for Si electronics, therefore, cannot be directly applied to flexible electronics. Other factors such as high supply voltage, large process variation, and lack of trustworthy device modeling also make designing larger-scale and robust TFT circuits a significant challenge.The objective of this article is to provide an in-depth overview of flexible electronics from their applications, manufacturing processes, device characteristics, to circuit and system design solutions. We first introduce the low-cost fabrication methods for flexible electronics, including ink-jet printing, screen printing, and gravure printing. The device characteristics and compact modeling of several major TFT technologies will be illustrated. We will then give an overview of digital and analog circuit design from basic logic gates to a microprocessor, as well as design automation tools and methods, for designing flexible electronics. We also describe a reliability simulation framework that can predict TFT circuits' performance degradation under bias-stress. This framework has been validated using the amorphous-silicon (a-Si) TFT scan driver for TFT-LCD displays. Finally, we will give an overview of flexible thin-film photovoltaics using different materials including amorphous silicon, CdTe, CIGS , and organic solar cells.

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Placement Optimization of Flexible TFT Digital Circuits

Cited by 3 publications

References 5 publications

Placement optimization of flexible TFT circuits with mechanical strain and temperature consideration

Placement optimization of flexible TFT circuits with mechanical strain and temperature consideration

Printed Electronics: Effects of Bending and a Self-Compensation Means

Design, Automation, and Test for Low-Power and Reliable Flexible Electronics

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