2006
DOI: 10.1080/00986440500267410
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Planar Copper Plating and Electropolishing Techniques

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Cited by 10 publications
(10 citation statements)
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“…To prevent this unphysical situation, the wall perpendicular components of the velocity vectors of the particles inside wall boundaiy layers were omitted and, thus, they are prevented from penetrating into solid walls. Information about the validation of the particle tracking tool can be found in Basol et al [8].…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…To prevent this unphysical situation, the wall perpendicular components of the velocity vectors of the particles inside wall boundaiy layers were omitted and, thus, they are prevented from penetrating into solid walls. Information about the validation of the particle tracking tool can be found in Basol et al [8].…”
Section: Methodsmentioning
confidence: 99%
“…Depending on the clocking position of the circular hot streak relative to the stator, a considerable change in the position and shape of the hot streak downstream of the stator was observed. The spanwise migration pattern of a circular hot streak inside the stator with axisymmetric endwalls was studied in a previous numerical work [8], revealing the effect of the aerodynamics of the first stage stator on the hot-streak migration pattern through the stage. It was shown that due to the opposite spanwise migration patterns on either side of the stator, the circumferential temperature gradients at the combustor outlet affect the spanwise heat load distribution on the downstream rows.…”
Section: Introductionmentioning
confidence: 99%
“…Numerous attempts have been made to meet the new Cu planarization requirements due to the use of fragile ultra-low-к materials in the near future. Most of them are focused on slurries [ 7 - 11 ] and the derivative technologies of CMP such as electrochemical mechanical planarization [ 12 - 15 ] and electrochemical mechanical deposition [ 16 - 18 ]. As we know, the polishing pad is one of the most important consumables and plays a critical role in CMP.…”
Section: Introductionmentioning
confidence: 99%
“…Η χημική απόθεση χαλκού χρησιμοποιείται κυρίως για τη διασύνδεση διαφόρων στρωμάτων των τυπωμένων κυκλωμάτων μέσω της επιχάλκωσης των οπών του (through-hole plating stage) (13,34,35,36) . Με την κλασική μέθοδο, περίπου 0.0000150 -0.000020 in χαλκού αποτίθενται χημικά (electroless plating) στις οπές και αυτή η επιχάλκωση επιτρέπει και τη μετέπειτα ηλεκτροχημική απόθεση χαλκού.…”
Section: επιχάλκωση οπώνunclassified
“…• (35) από την εταιρία ΙΝΤΡΑΚΟΜ Τα πρώτα δύο είδη χρησιμοποιήθηκαν για τη μελέτη της επιχάλκωσης επιφανειών. Τα δοκίμια PCB χρησιμοποιήθηκαν ώστε να μπορέσουμε να διαπιστώσουμε αν η διαδικασία επιχάλκωσης με τη βοήθεια της πολυπυρρόλης επιτρέπει την επιχάλκωση οπών πολυστρωματικών τυπωμένων κυκλωμάτων βιομηχανικών προδιαγραφών.…”
Section: μέθοδος εμβάπτισηςunclassified